The 2022 R2 Ansys Signal and Power Integrity release introduces significant simulation improvements for electronic printed circuit boards, IC packages, and interposers. Ansys SIwave delivers new features, including a new blending algorithm for AC-DC transition, enhancements for DDR Wizard, which now supports IBIS AMI models, RLCG matrix reduction operations in CPA, and improvements to SI Xplorer and Auto HFSS Regions. HFSS 3D Layout brings support for rigid-flex cable systems and support for encrypted 3D Layout components.
- How to use the new rigid-flex workflow to bend PCBs
- How to create encrypted 3D Layout components
- How to use the new features in SIwave and CPA such as wideband PSPICE model generation