Accelerating the Design of Advanced Analog Mixed Signal Circuits
Comprehensive suite of solutions to accurately model the electromagnetic, thermal, optical, power, and parasitic effects of interconnect layout on AMS circuit performance.
Ansys is committed to setting today's students up for success, by providing free simulation engineering software to students.
Ansys is committed to setting today's students up for success, by providing free simulation engineering software to students.
Ansys is committed to setting today's students up for success, by providing free simulation engineering software to students.
For United States and Canada
+1 844.462.6797
Comprehensive suite of solutions to accurately model the electromagnetic, thermal, optical, power, and parasitic effects of interconnect layout on AMS circuit performance.
Analog mixed-signal (AMS) semiconductors face challenges from rising signal frequencies, increasing design sizes, and the demands of advanced silicon manufacturing processes. These factors introduce complex nonlinear multiphysics effects in interconnect wires, which design teams often struggle to model accurately. The impact of interconnects on circuit performance is so significant that precise modeling of electromagnetic, RF, thermal, optical, parasitic, voltage drop, reliability, power, and other multiphysics interactions has become essential for successful designs.
Interconnect models must be re-extracted for every layout iteration, incorporating all relevant physics—including package/system interactions—even for large-scale designs like multi-die (3D-IC) systems and memories.
The Ansys AMS product suite provides a mature and strategic solution to the multiphysics interconnect challenge and is certified by all major foundries.
Debugging AMS designs is often manual, inefficient, and time-consuming, significantly increasing design costs. Ansys accelerates design convergence with advanced root-cause parasitic analysis, enabling teams to quickly identify fixes, meet deadlines, optimize chip performance, and ensure product reliability.
The growing application of wireless connectivity in many products and the increasing speed of integrated circuits have raised the importance of analog and mixed signal (AMS) circuits. These pose challenges distinct from those for digital design, and AMS design engineers must master a broad set of physical phenomena with unique market requirements.
Design and verification of AMS circuits face increasing complexity due to higher signal speeds and advanced manufacturing processes. Ansys addresses these challenges with powerful multiphysics simulation engines, seamlessly integrating chip, package, and system-level effects. Advanced analytics, AI-driven insights, and user-friendly workflows enhance designer productivity. Hierarchical reduced-order models (ROMs) and cloud enablement deliver scalable, high-capacity solutions, ensuring accurate and efficient simulation of even the most complex designs.
Ansys delivers a comprehensive suite of tools for AMS design, offering unmatched physical modeling capabilities, proven silicon accuracy, and system-level simulation integration. Its engines handle high-capacity, complex designs with exceptional speed and advanced cloud distribution. AI-driven automation enhances efficiency, solving non-linear behaviors and optimizing systems with minimal manual intervention. Trusted by industry leaders, Ansys provides a reliable, scalable, and innovative solution for advancing semiconductor technologies and tackling modern design challenges.
Ansys collaborates closely with all major foundries to achieve foundry certification that the multiphysics simulation results match silicon reality. This ongoing effort ensures that Ansys products are reliably accurate for all advanced process technologies, including the complex physical interactions that emerge for finFET and gate-all-around (GAA) structures, and advanced materials like silicon carbide (SiC).