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About This Webinar

Ensuring electronic assemblies meet lifetime requirements becomes difficult as complex components expended in more aggressive mechanical shock, vibration, and thermal cycling environments. Large, high i/o ball grid array (BGA) and quad-flat no-lead (QFN) packages are leveraged in harsh aerospace and automotive environments. Ensuring reliability in computing and data center applications can be equally tricky as novel package designs are strained to power-cycling extremes. One of the mitigation strategies to improve component lifetimes is to add underfills and adhesives to the assemblies.

This presentation outlines a consolidated workflow using Ansys Mechanical and Sherlock to evaluate several adhesive strategies on various electronic components, quantifying mechanical shock, vibration, and thermal cycling lifetime behavior. The workflow focuses on viscoplastic component-level simulation for thermal cycling and elastic board-level simulation for mechanical shock and vibration. Utilizing this workflow during material selection can help our users choose the proper adhesive strategy for both the component and the application, minimizing the risk of surprise tests or field failures related to incorrectly applied adhesive solutions

What You Will Learn

  • Strategies for selecting the best adhesive and underfill material for your board
  • Common mistakes to avoid when choosing materials and layouts
  • How simulation and physical testing can minimize the effects of surprise tests or field failures 

Who Should Attend

Analysts, PCB Design Engineers, Mechanical Engineers


Tyler Ferris