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Ansys HFSS 3D
Layout for PCB

Course Overview

The Ansys HFSS 3D Layout course for high-speed printed circuit board design focuses on layered structures using the 3D Layout design type in HFSS and AEDT (Ansys Electronic Desktop). This course is designed for intermediate-advanced users and includes 5 modules. It covers Padstacks, IBIS and Eye source setups, Parametric study, Package-PCB-Connector layout driven assembly (LDA), and DC IR analysis. Workshops include differential via structures, sub-design cutouts from larger printed circuit boards, and full ECAD and MCAD structures and simulations that follow realistic workflows from start to finish.

Prerequisites

  • Prior knowledge of Ansys HFSS 3D Layout Getting Started course is required.
  • Knowledge of high-speed digital circuit design, including S-parameters, transmission lines, and differential parts is highly recommended.
  • Knowledge of printed circuit board design, including vias, component reference designators, and layer stackups is valuable. 

Target Audience

Electronic engineers working with high-speed printed circuit board (PCB) design and signal integrity.

Teaching Method

Lectures and hands-on simulation workshops to develop familiarity and productive skill in using HFSS 3D Layout.

Learning Path

Ansys-hfss-3d-layout-for-pcb.png

Learning Outcome

Upon completion of this course, you will be able to:

  • Work with HFSS 3D Layout via Padstack automation, Padstack definitions and usage.
  • Create differential vias, traces, and ground plane on different layers and assigning net names, boundary conditions and excitations.
  • Incorporate package, PCB and IBIS models in one environment and use the Nexxim transient circuit simulator from the layout interface of the AEDT.
  • Setup eye sources and terminations on the layout and generate eye diagrams.
  • Run parametric study to predict the performance of a PCB with manufacturing tolerance.
  • Combine MCAD and ECAD models and make sub-design cutouts at the desired extent in HFSS 3D Layout and analyze them all together.
  • Setup connector/package/board models in one environment and choose the solver. technology that is best for each simulation and run an LNA simulation on the concatenated model.
  • Setup a DC IR simulation and compute DC current and voltage distribution, plot DC IR field overlays, and export DC IR simulation results using HFSS 3D Layout.

Available Dates

Date / Time Duration Event Type Location Language Course Cost Registration
June 14, 2021
11:00 - 13:00   EST (GMT-5)
3 Sessions
June 14-16
Virtual Virtual - WebEx English Subscription Only REGISTER
September 27, 2021
11:00 - 13:00   EST (GMT-5)
3 Sessions
Sep 27-29
Virtual Virtual - WebEx English Subscription Only REGISTER
October 5, 2021
10:00 - 12:00   CET (GMT+1)
3 Sessions
Oct 5-7
Virtual Virtual - WebEx English Subscription Only REGISTER
December 13, 2021
11:00 - 13:00   ET (GMT-5)
3 Sessions
Dec 13-15
Virtual Virtual - WebEx English Subscription Only REGISTER

Learning Options

Training materials for this course are available with an Ansys Learning Hub Subscription. If there is no active public schedule available, private training can be arranged. Please contact us.

Agenda

This is a 1.5-day classroom course covering both tutorials and workshops. For virtual training, this course is covered over 3 x 2-hour sessions. 

Virtual Classroom Session 1

  • Module 1: Lecture1 Padstacks
  • Workshops 1.1: Differential Via Padstacks
  • Workshop 1.2: Differential Via Construction

Virtual Classroom Session 2

  • Module 2:
  • Workshop 2.1: Package-PCB assembly and IBIS Setup
  • Module 3:
  • Workshop 3.1: Serial Channel Performance

Virtual Classroom Session 3

  • Module 4:
  • Workshop 4.1: Connector-PCB Cutout
  • Workshop 4.2: Package-Connector-PCB
  • Module 5:
  • Workshop 5.1: DCIR

Day 1

  • Module 1: Lecture1 Padstacks
  • Workshops 1.1: Differential Via Padstacks
  • Workshop 1.2: Differential Via Construction
  • Module 2:
  • Workshop 2.1: Package-PCB assembly and IBIS Setup
  • Module 3:
  • Workshop 3.1: Serial Channel Performance

Day 2 (Half-day)

  • Module 4:
  • Workshop 4.1: Connector-PCB Cutout
  • Workshop 4.2: Package-Connector-PCB
  • Module 5:
  • Workshop 5.1: DCIR