The Ansys HFSS 3D Layout course for high-speed printed circuit board design focuses on layered structures using the 3D Layout design type in HFSS and AEDT (Ansys Electronic Desktop). This course is designed for intermediate-advanced users and includes 5 modules. It covers Padstacks, IBIS and Eye source setups, Parametric study, Package-PCB-Connector layout driven assembly (LDA), and DC IR analysis. Workshops include differential via structures, sub-design cutouts from larger printed circuit boards, and full ECAD and MCAD structures and simulations that follow realistic workflows from start to finish.
- Prior knowledge of Ansys HFSS 3D Layout Getting Started course is required.
- Knowledge of high-speed digital circuit design, including S-parameters, transmission lines, and differential parts is highly recommended.
- Knowledge of printed circuit board design, including vias, component reference designators, and layer stackups is valuable.
Electronic engineers working with high-speed printed circuit board (PCB) design and signal integrity.
Lectures and hands-on simulation workshops to develop familiarity and productive skill in using HFSS 3D Layout.