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Working Towards a Simulation-Enabled Sustainable Future for High Tech/Semiconductor Manufacturing

Ansys Semiconductor Manufacturing Webinar Series

The ever-increasing complexity of chip design, the implications of technology for national health and security, and the drive to reduce the environmental impact have shaped the critical significance of high-tech manufacturing. Join us for this three-part webinar series to learn about how Ansys simulation can help address complex manufacturing and sustainability challenges.

Register to attend one or all three webinars below!

Date:
Webinar 1: Thursday, April 25, 2024 at 8 AM PDT

Webinar 2: Thursday, May 23, 2024 8 AM PDT

Webinar 3: Thursday, June 13, 2024 8 AM PDT

Location:
Virtual

Contact:
Harish Kanchi

Chip package board
April 25, 2024 8:00 AM PDT
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Webinar 1: Improving Semiconductor Wafer Fabrication Process Efficiencies Using Ansys Solutions

We will cover the following topics in this course:

  • Importance of Simulation in Fabrication Process
  • Reducing Wafer Cycle Time
  • Using Ansys Tools to Model the Fabrication Process
  • Optimizing Fabrication Process
  • System Level Modeling of Fabrication Process
May 23, 2024 8:00 AM PDT
semiconductor-packaging.png
Webinar 2: Reducing Semiconductor Packaging Defects with Ansys Tools

We will cover the following topics in this course:

  • Reducing Manufacturing Defects During Packaging
  • Ansys Tools for Modeling Packaging Assembly
  • Selecting and Handling Materials for Sustainability
June 13, 2024 8:00 AM PDT
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Webinar 3: Unlocking Sustainability: Harnessing Simulations in Semiconductor & High-Tech Manufacturing for a Greener Future

We will cover the following topics in this course:

  • Challenges in Semiconductor and High-Tech Manufacturing 
  • Importance of Simulations in Addressing Challenges 
  • Key Applications/ Areas where Ansys Simulation Tools Helped Reduce Carbon Footprint 

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