Product Specs
Perform conduction, convection and radiation conjugate heat transfer analyses, with many advanced capabilities to model laminar and turbulent flows, and species analysis including radiation and convection.
Ansys Icepak
Cooling Simulation Software for Electronic Components
Ansys Icepak is a CFD solver for electronics thermal management. It predicts airflow, temperature and heat transfer in IC packages, PCBs, electronic assemblies/enclosures and power electronics.
Electronics Cooling & PCB Thermal Simulation and Analysis
Ansys Icepak provides powerful electronic cooling solutions that utilize the industry leading Ansys Fluent computational fluid dynamics (CFD) solver for thermal and fluid flow analyses of integrated circuits (ICs), packages, printed circuit boards (PCBs) and electronic assemblies. The Ansys Icepak CFD solver uses the Ansys Electronics Desktop (AEDT) graphical user interface (GUI).
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Unstructured, Body-fitted Meshing
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Comprehensive Thermal Reliability Solution
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High-fidelity CFD Solver
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Industry Leading Multiscale Multiphysics
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MCAD and ECAD Support -
Solar radiation -
Parametrics and Optimization -
Customization and Automation
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Network Modeling -
DC Joule Heating Analysis -
Electro-thermal and Thermo-Mechanical -
Extensive Libraries for Thermal
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Liquid Cooling -
Dynamic Thermal Management -
Varying Flow and Power ROM
Creotech Instruments Creates Next-Generation Microsatellites with Multiphysics Simulation
Creotech implements leading-edge methodologies developed by the European Space Agency to design, assemble and integrate critical equipment that meets space standards.
Repairing orbiting microsatellites is impossible due to extreme logistical challenges. Satellite engineers must ensure that equipment is space-proven and extremely reliable before launch. Creating individual satellite components generates high costs, requiring satellite integrators to meet stringent design requirements and satisfy high production process standards. Creotech Instruments’ use of multiphysics simulation effectively addresses these complex challenges.
March 2026
What's New
The 2026 R1 adds major speed and productivity gains: faster simulations and post-processing, improved mesh and Joule heating solvers, better PCB/STM workflows, clearer CTM visualization, and streamlined geometry modeling.
Enhanced User Experience (UI) & Workflow
Major performance and and productivity upgrades − faster simulations, parallelized post-processing, clearer CTM visualization, streamlined geometry modeling, and improved PCB data workflows, and more − enabling engineers to iterate quicker, analyze results faster, and deliver more accurate thermal designs with less manual effort.
Improved Meshing, Solving and Physics
Boosts meshing and multiphysics reliability with improved mesh fusion, a native CPU/GPU Joule heating solver, and faster network modeling. It also enhances boundary setup, system-level thermal control, and produces higher-quality auto-hexa meshes, enabling more accurate, stable simulations and smoother workflows.
System Level Thermal Management
Icepak’s STM workflow is now faster and easier, with a 3–5x quicker setup, 80% far fewer clicks, and more stability. STM creation is optimized with automatic reporting and flexible steady-state/transient options. The Ansys Discovery-to-Icepak connection automates physics transfer, speeding system-level thermal modeling.
Predict airflow, temperature and heat transfer for electronics assemblies and printed circuit boards
With CAD-centric (mechanical and electrical CAD) and multiphysics user interfaces, Icepak facilitates the solving of today’s most challenging thermal management problems in electronics products and assemblies. Icepak uses sophisticated CAD healing, simplification and metal fraction algorithms that reduce simulation times, while providing highly accurate solutions that have been validated against real-world products. The solution’s high degree of accuracy results from the highly automated, advanced meshing and solver schemes, which ensure a true representation of the electronics application.
Key Features
Icepak includes all modes of heat transfer — conduction, convection and radiation — for steadystate and transient electronics cooling applications.
- Electronics Desktop 3D layout GUI
- DC joule heating analysis
- Multiple-fluid analysis
- Reduced order flow and thermal
- Thermo-electric cooler modeling
- Package characterization
- Integrated graphical modeling environment
Work Smarter with Product Bundles
Thermal Analysis Product Pairings
Improve wireless communications, boost signal coverage and maintain connectivity for antenna systems, predict product performance and establish safe operating temperatures with these product pairings.
| Electromagnetic Losses with Thermal Coupling For Temperature-Dependent Antenna Performance Assessment (Icepak & HFSS) |
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| Ensuring the thermal stability of antenna-enabled 5G infrastructure, automotive radar, IoT devices and mobile electronic devices is critical in producing expected behavior. Power hungry activity such as video calls, online-based games or varying environmental conditions causes significant swings in device temperatures. If a phone’s battery becomes too hot, it can lose charge or even create safety issues. Also, high temperatures can affect other electronic components within a phone and impact RF antenna performance. Breakdown of a phone’s connectivity with mobile carriers, Bluetooth or Wi-Fi is traceable to thermal problems. You can predict these issues before you build the hardware by simulating your design using Ansys tools. For example, electrical engineers can dynamically link Ansys HFSS and Ansys Icepak in the Electronics Desktop to simulate the temperature of the antenna. Based on the electromagnetic and thermal coupling solutions, they can modify antenna design and predict antenna efficiency and the overall thermal and EM performance of the product. These EM and thermal simulations help to improve wireless communications, boost signal coverage and maintain connectivity for antenna-enabled systems. |
| Board-Level Electrothermal Coupling (Icepak and SIwave) |
| Even a marginal rise in temperature can affect the performance and reliability of electronic components, leading to system-wide problems. Board-level power integrity simulations within SIwave can be combined with Icepak thermal simulations to get a complete picture of a PCB’s electrothermal performance. SIwave and Icepak automatically exchange DC power and temperature data to calculate Joule heating losses within PCBs and packages to obtain highly accurate temperature field and resistive loss distributions. These DC electrothermal solutions let you manage the heat produced by your designs and predict thermal performance and safe operating temperatures of chips, packages and boards. |
ICEPAK RESOURCES & EVENTS
Featured Webinars
On Demand Webinar
Ansys 2023 R1: What's New in Ansys Icepak & Mechanical in AEDT
Learn about the latest updates and newest functionality in Ansys Icepak and Mechanical in AEDT.
On Demand Webinar
Thermal Management for Power Electronics
This webinar showcases Icepak’s solutions for power electronics.
On Demand Webinar
Ansys Icepak and Sherlock For Temperature Cycling
This webinar will demonstrate an automated process of thermal modeling of printed circuit boards.
Case Studies
Webinars on Demand
Blogs
Ansys software is accessible
It's vital to Ansys that all users, including those with disabilities, can access our products. As such, we endeavor to follow accessibility requirements based on the US Access Board (Section 508), Web Content Accessibility Guidelines (WCAG), and the current format of the Voluntary Product Accessibility Template (VPAT).
Let’s Get Started
If you're facing engineering challenges, our team is here to assist. With a wealth of experience and a commitment to innovation, we invite you to reach out to us. Let's collaborate to turn your engineering obstacles into opportunities for growth and success. Contact us today to start the conversation.