Proven sign-off leader for integrity and reliability of ICs

ANSYS RedHawk is an industry standard power noise and reliability sign-off solution for your SoC designs. With a track record of thousands of designs in silicon, RedHawk enables you to create high-performance SoCs that are still power efficient and reliable against thermal, electromigration (EM) and electrostatic discharge (ESD) issues for markets such as mobile, communications, high-performance computing, automotive and Internet of Things (IoT).

Redhawk has been the go-to sign-off solution for all foundries and processes since 2006, enabling you to create robust, low-power, high-performance SoCs in the most advanced FinFET technology. This includes accurate self-heat and thermal-aware EM analyses.

RedHawk’s advanced Distributed Machine Processing (DMP) enables significantly higher capacity and better performance for full-chip IR/dynamic voltage drop, power/signal electromigration (EM) and electrostatic discharge (ESD) analyses.

System-Aware Chip Design
RedHawk’s complete and accurate model-based interoperability with ANSYS board and system-level tools ensures that your chip works as intended in the system.



  • Chip-Package Co-Analysis

    Chip-package-system co-analysis provides superior simulation accuracy and greater design insight than current independent analyses of chip and package.

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  • Thermal-Aware EM

    Redhawk identifies thermal integrity and thermal-aware reliability issues, which can have a significant impact on power (leakage), IR, timing and electromigration (EM), especially in automobile applications.

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  • Capacity and Performance

    RedHawk offers you the capacity and performance to simulate designs having over 1 billion instances using advanced Distributed Machine Processing (DMP) techniques.

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  • Silicon-Validated Signoff Accuracy

    Provides foundry-certified accuracy for the reduced noise margins and higher voltage drops typical for FinFET designs.

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  • Power Noise Impact on Timing

    RedHawk helps you understand the impact of dynamic voltage drop on timing for clock and critical paths using full-chip-level timing-impact analysis in a SPICE-based sign-off simulation.

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  • Integrity and Reliability of Advanced IC Packaging

    Encapsulating chips within a 2.5-D or 3D package improves power, performance and form factor. Redhawk is qualified for the 2.5-D and 3D package reference flows.

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See how our customers are using our software:

Automotive Thermal Reliability

Automotive Thermal Reliability

Electronics in modern automobiles must operate in a high-temperature under the hood environment without sacrificing performance or reliability. Traditional approaches to thermal design based on constant-temperature are no longer reliable. ANSYS’ fine-grain temperature calculation enables NXP to perform thermal-aware electromigration (EM) analysis.

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