Ansys Strategic Partners

Ansys and Microsoft use their industry-leading capabilities, such as cloud HPC and IoT digital twin, to advance state-of-the-art engineering simulation across many industries. The partnership with Microsoft empowers customers to swiftly sole the most challenging engineering problems - substantially increasing productivity, cutting development costs and expediting time to market. Get in touch with us to learn more about Ansys Cloud, Digital Twin, and others solutions we are developing together.

Ansys and Synopsys forged a partnership in 2017 to enable customers to accelerate the next generation of high-performance computing, mobile and automotive products. The partnership tightly integrates Ansys' power integrity and reliability signoff technologies with Synonsys' physical implementation solution for in-design. 

In March 2018 Synopsys announced Redhawk Analysis Fusion. Since the partnership has continued to grow developing new products and cohesive workflows.  In April 2020 Synopsys announced 3DIC Compiler with Ansys' RedHawk™ family of silicon-proven analysis capabilities to address the 3D IC market.

In 2018, Ansys and PTC announced the integration of Ansys Discovery real-time simulation technology directly into the PTC Creo CAD modeling environment, allowing designers to get instant feedback. PTC’s Creo Simulation Live launched in February 2019, and in November 2020, Creo Ansys Simulation introduced higher-fidelity Ansys simulation solvers within Creo.

In addition, PTC and Ansys announced a solution that enables Ansys simulation-based digital twin technology to be added to applications built on the PTC ThingWorx IoT platform.

Our strategic partnership with Rockwell Automation, announced in 2019, provides industrial companies with the ability to deploy simulation-based digital twins to improve the design and operation of their products and manufacturing processes.

The partnership helps customers optimize factory operations, saving money by reducing unplanned downtime and enabling engineers to test virtual “what if” scenarios solutions without disrupting physical assets.

The Autodesk and Ansys partnership aims to break down silos in the product development process to expedite products to market. In November 2019, a designer-to-simulation analyst workflow was announced, connecting Autodesk Fusion 360, the integrated design and manufacturing software, with Ansys Mechanical and Ansys Discovery simulation solutions.

And in November 2022, Autodesk released Fusion 360 Signal Integrity Extension, powered by Ansys, which embeds Ansys electromagnetic simulation capabilities to provide printed circuit board (PCB) designers access to near real-time insights earlier in the design process for intelligent consumer products.

Ansys software gives engineers a powerful toolkit for market-leading simulation. However, powerful tools require powerful infrastructure to expand innovation, reach insights faster, and minimize risk.
 

HPE and Ansys collaborate to ensure customers achieve the best possible  performance from their Ansys applications. With HPE’s industry-leading CAE products, manufacturers can get better-performing products to market faster, improving ROI and efficiency.

Discover how HPE can help your company achieve its digital engineering goals through optimized infrastructure performance.