Comprehensive PCB, IC and IC package solutions
Ansys offers a complete, most powerful, accurate and scalable simulation solution for printed circuit boards (PCBs), integrated circuits (ICs), and IC Packages for accurate evaluation of an entire system.
Printed circuit boards (PCBs), ICs and IC packages are used in almost all electronic products across all industries: automotive, A&D, consumer electronics, healthcare and energy. With electronics getting smaller, engineers need to design boards that are smaller than ever and incorporate all the required features. Accurate modeling and simulation of these components are key to reliable end products.
Ansys signal integrity (SI) analysis products are essential for designing the high-speed serial channels, parallel buses and complete power delivery systems found in modern high-speed electronic devices. These integrated electromagnetics (EM) and circuit simulation tools predict EMI/EMC, power integrity and SI issues, resulting in optimized system performance prior to the build-and-test process.
The potential for failure in electronic systems due to thermal and mechanical loading of printed circuit boards (PCBs) is escalating due to steadily increasing power dissipation, combined with smaller board sizes. Learn how to prevent PCB failures due to thermal and mechanical stresses.
It is not uncommon to have a design fail in the field due to signal integrity issues, even though simulation shows it should work perfectly, because the as-manufactured product differs from the design definition. To avoid this problem, the signal integrity engineer needs to understand what will be delivered and use simulation to verify that the frequency- and time-domain performance will meet the design requirements.
Un solveur de champ électromagnétique 3D pour concevoir des composants électroniques haute fréquence et haute vitesse. Ses solveurs FEM, IE, asymptotiques et hybrides traitent les problèmes de RF, micro-ondes, IC, PCB et EMI.
A computational fluid dynamics (CFD) solver for electronics thermal management. It predicts airflow, temperature and heat transfer in IC packages, PCBs, electronic assemblies, enclosures and power electronics.
Ansys Q3D Extractor calcule le paramètre parasite de la résistance, de l'inductance, de la capacité et de la conductance (RLCG) dépendant de la fréquence pour les produits électroniques.
In this webinar, learn how Ansys SIwave, Ansys Icepak, Ansys Mechanical and Ansys Sherlock can be used as a comprehensive multi-physics solution to optimize PCB reliability.