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Ansys RedHawk-SC Electrothermal
Electrothermal Power and Thermal Integrity for 3D-IC

Ansys RedHawk-SC Electrothermal solves multiphysics power integrity, signal integrity,  and thermal and mechanical stress equations for 2.5D/3D multi-die IC systems for prototyping, with billions of concurrent instances.

MULTIPHYSICS SIGNOFF FOR 3DIC

Electrical, Mechanical and Thermal Signoff Solution for 2.5D/3D IC Packaging

Ansys RedHawk-SC Electrothermal is a multiphysics solution for analyzing multi-die chip packages and interconnects for power integrity, parasitic extraction, signal integrity, thermal behavior and thermo-mechanical stress. It works together with the RedHawk-SC power integrity platform and is integrated with AEDT/Icepak board/system analysis tools. RedHawk-SC Electrothermal is foundry certified for integrated fanout and silicon interposer technologies.

  • Option to RedHawk-SC
    Option to RedHawk-SC
  • Generates Hierarchical Models
    Generates Hierarchical Models
  • Integrated with AEDT/Icepak
    Integrated with AEDT/Icepak
Multiphysics Signoff for 3DIC

Quick Specs

Ansys RedHawk-SC Electrothermal solves the electrical and thermal coupling interactions of 2.5D/3DIC structures in full detail for up to a billion instances, concurrently. It uses best-in-class engines from RedHawk-SC and Ansys Mechanical to solve power, signal electromigration, thermal and stress equations on heterogeneous inputs.

  • Dynamic & Static Power
  • Billion Instances Concurrently
  • Early Prototyping Capability
  • Signal/Power EM
  • Chip/Package Co-optimization
  • Generates Thermal Models
  • Thermal-aware IR and EM
  • Elastic Cloud Compute
  • Extracts SI Parasitics
  • Solves Mechanical Stress
  • Calculates Mechanical Displacement
  • Heterogeneous Inputs

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BUSINESS BENEFITS

RedHawk-SC Electrothermal meets the challenge of today’s complex 2.5D/3D IC packages with a comprehensive multiphysics approach that unifies electrical and thermal analysis at the chip, board and system levels.

Modern multi-die packages with 2.5D interposers or 3D stacking technology assemble complex integrated systems that are tightly coupled across a range of physics, including power integrity, signal integrity, thermal and mechanical stress/warpage. The only way to accurately predict the overall behavior of these systems is with a unified analysis environment that brings together market-leading engines from multiple tools into a simultaneous multiphysics solution.

RedHawk-SC Electrothermal lowers design time and design risk with integrated access to Ansys analysis algorithms, from industry-leading chip, board and system-level tools across multiple disciplines. Its range is unmatched by any other product.

This has led major foundries to certify RedHawk-SC Electrothermal as a signoff solution for their multi-die packaging technologies.

Its high capacity and silicon-correlated accuracy not only reduces risk but also allows reduced safety margins, which leads to significant reductions in power and higher performing designs.

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An Electrical, Mechanical and Thermal Multiphysics Signoff Solution for  2.5D/3D IC Packaging

Ansys RedHawk-SC Electrothermal solves the electrical and thermal multiphysics interactions of multi-die 2.5D/3DIC structures in full detail. It uses best-in-class engines from Ansys RedHawk-SC, including thermal and mechanical tools to solve power, SI, and stress equations for heterogeneous systems.

RedHawk-SC Electrothermal solves accurate electrothermal, mechanical stress and displacement equations. Using the elastic compute infrastructure from RedHawk-SC, it has the capacity to analyze up to a billion instances, concurrently. It includes comprehensive prototyping capabilities with early block power estimates. Thermal analysis automatically launches AEDT/Icepak to get boundary conditions from system-level analysis.

 

Key Features

RedHawk-SC Electrothermal is a foundry-certified high-capacity electrothermal solver for 2.5D/3D prototyping and chip/package multiphysics co-analysis.

  • Billions of instances simultaneously
  • Best-in-class analytic engines
  • Seamlessly handles heterogeneous inputs
  • Prototyping with early block estimates
  • Integrated with AEDT/Icepak
  • Cloud-native elastic compute

The entire 2.5D/3D package power distribution network is analyzed for IR-drop, current density and electromigration. The peak current is reported for each individual pad. These analyses are all thermal-aware, including Joule self-heating.

Accurate thermal analysis is performed on the entire system. Boundary conditions are automatically obtained by launching Ansys Electronics Desktop and Ansys Icepak for thermal analysis of the PCB/system level.

To accurately calculate signal integrity (SI) effects in the package interconnect, RedHawk-SC Electrothermal will extract the RC parasitics of both signal and power interconnects across the entire 3D stack of the multi-die package.

Ansys RedHawk-SC Electrothermal includes the market-leading analytic engine from Ansys Mechanical. It calculates mechanical stresses and warpage experienced by various elements in the package due to thermal expansion.

Ansys RedHawk-SC Electrothermal can provide early prototype feedback on the thermal and power integrity characteristics of a package based on early estimates for power drawn by each block. All results are displayed in an interactive multi-die viewer for analysis.

Multi-die systems are made up of multiple elements that are often complex designs in their own right. Also, the entire 3D assembly needs to be placed in the analysis of the complete top-level system view. RedHawk-SC Electrothermal facilitates this with an extensive library of reduced order models to capture power, thermal, signal integrity, and ESD  behavior for easy compact exchange and hierarchical analysis.

Ansys RedHawk-SC Electrothermal is built on the SeaScape big data analytics platform that is designed for cloud execution on 1,000s of CPU cores with near linear scalability and extremely high capacity with low memory per core.

ANSYS REDHAWK-SC ELECTROTHERMAL RESOURCES & EVENTS

Featured Webinars

On Demand Webinar
Discovery Webinar Series

Electrothermal Signoff for 2.5D and 3D-IC Systems

This webinar showcases tools, such as Ansys RedHawk-SC Electrothermal, and techniques for modeling multi-die systems, like HBM and PCIE interfaces, with silicon interposers, through-silicon vias (TSVs) and microbumps.

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