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Ansys SIwave
Signal Integrity, Power Integrity, and EMI Analysis for PCB Design

A specialized tool for power integrity, signal integrity and EMI analysis of IC packages and PCBs. Solves power delivery systems and high-speed channels in electronic devices.

Dedicated PCB & Package Electromagnetics Simulation Software

SIwave helps you model, simulate and validate high-speed channels and complete power delivery systems typical in modern high-performance electronics. It accurately extracts multi-gigabit SERDES and memory buses, providing product sign-off compliance for various designs. SIwave’s full wave extraction of complete power distribution networks (PDN) enables you to verify noise margins and ensure impedance profiles are met through automatic decoupling analysis in low-voltage designs.

  • Electromagnetics icon
    Full-Wave SI/PI Extraction
  • Electromagnetics icon
    Feature: Virtual
  • Electromagnetics icon
    Impedance / Crosstalk / EMI Scanning
  • Electromagnetics icon
    Electro-Thermal Design
slwave DCIR

Product Specs

SIwave helps you model, simulate and validate high-speed channels and complete power delivery systems typical in modern high-performance electronics. It accurately extracts multi-gigabit SERDES and memory buses, providing product sign-off compliance for various designs.

  • Layout and Geometry Import
  • IBIS and IBIS-AMI SerDes Analysis
  • Impedance and Crosstalk Scanning
  • EMI Solution
  • Electrothermal Analysis
  • Virtual Compliance
  • Multidomain System Modeling
  • High-Performance Computing
  • Automated Decoupling Capacitor
  • Electromigration Analysis

January 2024

What's New

The SIwave 2024 R1 release includes near field simulation in HFSS 3D layout.

Near Field Simulation in HFSS 3D Layout

Dramatically increasing simulation speed at the system level. One of many applications that benefit from this is EMI simulation for PCBs.

SIwave Applications

View all Applications
electronics hfss

PCBs, ICs and IC packages

Ansys’ complete PCB design solution enables you to simulates PCBs, ICs, and packages and accurately evaluate an entire system.



Minimizing electromagnetic interference with simulation delivers high-performance, compliant and safe electronics systems, down to the microchip level.


Electronics Reliability

Learn how Ansys integrated electronics reliability tools can help you  solve your biggest thermal, electrical and mechanical reliability challenges.

SIware applications


SIwave leverages advanced electromagnetic, thermal and mechanical simulators to dynamically link circuit and system simulation

Successful design of next-generation electronic products requires power integrity, signal integrity and thermal integrity co-analysis. SIwave uniquely handles the complexity of interconnect design from die-to-die across ICs, packages, connectors and boards.

SIwave enables electronics companies to achieve a competitive advantage with faster time to market, reduced costs and improved system performance.

Slware Capabilities


Key Features

SIwave helps you understand the performance of high-speed electronic products long before building a prototype in hardware.

  • 3-D solid modeling
  • Power-integrity analysis
  • Signal-integrity analysis
  • Many extraction types
  • Advance adaptive mesh refinement
  • High-performance computing

There are various extraction types supported by SIwave such as IC packaging RLCG IBIS for signals and power, touch panel RLCG unit cell, bus bar RLCG, power inverter/converter, and a specialized thin-plane solver for touch panel extractions.

EMI Scanner and EMI Xplorer provide automatic and customizable EMI design rule checks to quickly identify areas of potential interference on the design prior to simulation.

Ansys SIwave provides a DDR virtual compliance kit which in combination with DDR Wizard provides an end-to-end virtual compliance for designs using DDR technology.  Additionally, our new SPISim technology allows for simple compliance reporting for USB-C and COM calculations for IEEE 802.3bj and 802.3bs channels. The programming environment also enables customization and support to add eye masks and limit lines for different type of standards.

This multiphysics solution enables accurate thermal modeling of IC packages and PCBs using DC power loss from SIwave as a heat source. Icepak solves the challenges associated with dissipation of thermal energy from electronic components that may cause premature component failure due to overheating. You can then evaluate thermal stress with Ansys Mechanical. This multiphysics approach enables you to perform coupled EM–thermal–stress analysis for a complete understanding of the design prior to manufacturing.


Featured Webinars

On Demand Webinar
Ansys Webinar
Real-time Optical Simulation for Reliable and Innovative Automotive Lighting Designs

Learn how Speos predicts the illumination and optical performance of systems, for both interior and exterior lighting, to help engineers reduce development time and costs while improving their product’s accuracy.

On Demand Webinar
HFSS Regions in SIwave
Optimizing Speed with HFSS Regions in SIwave

Learn how the speed and accuracy of Ansys SIwave can be improved by leveraging HFSS Regions in SIwave, a cutting-edge technique for supporting high-speed printed circuit board (PCB) channel design requirements.

On Demand Webinar
Ansys On Demand Webinar
Ansys 2021 R1 Update: EMA3D Cable Faster EMC Solving for Large Systems

Join us for this webinar which showcases new Ansys EMA3D Cable features to help you streamline manual cable design.

Case Studies

Ansys Case Study pcb

Ansys + Creotech Instruments

Large-scale system analysis – calculated power integrity to drive faster evaluation of PCB power-related issues. 


Ansys software is accessible

It's vital to Ansys that all users, including those with disabilities, can access our products. As such, we endeavor to follow accessibility requirements based on the US Access Board (Section 508), Web Content Accessibility Guidelines (WCAG), and the current format of the Voluntary Product Accessibility Template (VPAT).

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