Ansys 2022 R1: Electronics Reliability Update
Ansys 2022 R1 introduces significant advances across the Ansys suite of tools supporting Electronics Reliability applications. In addition to critical enhancements within Ansys Sherlock, Mechanical, LS-DYNA, and Icepak, new tool integrations and workflow solutions advance state-of-the-art simulation.
What Attendees Will Learn
- Ansys Sherlock Integration with Ansys AEDT Icepak
- Enhanced Ansys Sherlock + Ansys Mechanical Reinforcements Workflow
- Chip- and Die-Level Model Pre-Processing Enhancements in Ansys Sherlock
- Ansys Mechanical Trace Mapping Enhancements
- Scripting, Automation, and Design Exploration Workflow Enhancements
We'll also discuss additional enhancements to Ansys Sherlock, Mechanical (including powerful meshing enhancements), LS-DYNA, and Icepak that provide additional insights and improve productivity.
Speaker: Kelly Morgan, Principal Application Engineer, Ansys