Ansys Sherlock is the only reliability physics-based electronics design tool that provides fast and accurate life predictions for electronic hardware at the component, board and system levels in early stage design.
Ansys Sherlock provides fast and accurate life predictions for electronic hardware at the component, board and system levels in early design stages. Sherlock bypasses the ‘test-fail-fix-repeat’ cycle by empowering designers to accurately model silicon–metal layers, semiconductor packaging, printed circuit boards (PCBs) and assemblies to predict failure risks due to thermal, mechanical and manufacturing stressors--all before prototype.
With embedded libraries containing over one million parts, Sherlock rapidly converts electronic computer-aided design (ECAD) files into computational fluid dynamics (CFD) and finite element analysis (FEA) models. Each model contains accurate geometries and material properties and translates stress information into validated time-to-failure predictions. Sherlock parts databases also include a link to Ansys Granta Materials Selector.
January 2025
In 2025 R1, Ansys Sherlock updates include thermal-mech life predictions, PySherlock automated workflows, and improved state-awareness checks.
A new beta feature enables Thermal-Mech Life Predictions for BGA components (using SAC305 Solder). Using an FEA-based approach, this new workflow helps account for system-level effects and additional behaviors, providing further insights into solder joint fatigue studies. This workflow includes a new feature that creates detailed BGA package models for Thermal-Mech analyses.
With PyWorkbench and PyMechanical, new PySherlock APIs help facilitate the end-to-end automation of submodel and plug model workflows. ICT analyses can now be automated, leveraging new APIs to work with Test Points and Fixtures. Users can go further by integrating scripts for this into Ansys optiSLang to perform sensitivity and optimization studies.
Improved state-awareness checks allow models in Ansys Workbench/Mechanical to go out-of-date when making changes in Ansys Sherlock that will affect the model's state. Implemented optimizations in the RST file import process. Some processes now use parallel processing with the number of threads controlled by a direct setting. A new FEA setting called "copy imported RST file," which, when disabled, will cause Sherlock to access the imported RST from its source location instead of copying the file into the module working directory.
The Sanden Group is a Tier 1 automotive supplier of air conditioning compressors based in Japan and has locations worldwide. In 2020, Sanden Manufacturing Europe decided to test Ansys Sherlock automated design analysis software to analyze printed circuit boards (PCBs) for its electrical compressors. Using Ansys Sherlock, Sanden cut model creation time from 7 days to 1.
Electrical, mechanical, and reliability engineers can work in tandem to implement design best practices, predict product lifetimes and reduce failure risks.
Sherlock reduces expensive build-and-test iterations by virtually running thermal cycling, power-temperature cycling, vibration, shock, bending, thermal derating, accelerated life, natural frequency, and CAF to adjust designs in near real-time and achieve qualification in one round. In post-processing simulation results from Icepak and Mechanical, and LS-DYNA, Sherlock can predict test success and estimate warranty return rates. Icepak, Mechanical, and LS-DYNA users are more efficient by directly connecting simulation to material and manufacturing costs.
Unlike any other tool on the market, Sherlock uses files created by your design team to build 3D models of electronic assemblies for trace modeling, post-processing, and reliability predictions. This early insight immediately identifies areas of concern and allows you to adjust and retest designs quickly.
Pre- and Post-Processor for Ansys Mechanical, Icepak & LS-DYNA
The over one-million-part material library in Sherlock allows the creation of accurate and complex FEA and CFD models.
SHERLOCK RESOURCES & EVENTS
Printed circuit boards (PCBs) are the backbone of almost all electronic devices--making PCB reliability critical for the electronics industry. In this webinar, we'll discuss how engineers can use Ansys Sherlock to predict PCB reliability, including solder fatigue, temperature cycling, random and harmonic vibration and more.
In this short video, you will learn the basics of Ansys Sherlock, our printed circuit board (PCB) reliability prediction tool. Ansys Sherlock software is meant to be used early in the design stage to analyze for possible failure risk before prototype. This short video includes Sherlock capabilities, use cases and a live demo.
In this webinar, we will discuss a range of pre-processing/modeling techniques that are available in Ansys Sherlock for addressing such challenges, as well as the relative merits of these approaches, to help you ensure you are choosing the right level of fidelity for your studies.
If you're facing engineering challenges, our team is here to assist. With a wealth of experience and a commitment to innovation, we invite you to reach out to us. Let's collaborate to turn your engineering obstacles into opportunities for growth and success. Contact us today to start the conversation.
