Skip to Main Content

Speed Up Your Electronic Component Design with HPC

Electronic components design and their integration on PCBs involve complex simulations to accurately predict EM fields and forces. These simulations can be computationally intensive and time-consuming. High-performance computing (HPC) capability built into Ansys Maxwell core technology significantly accelerates the electronic component design process, enabling quick iteration, optimization, and validation. Maxwell's ECAD capability allows modeling and simulation of the PCB along with its components and interdependencies. This system-level simulation enables faster identification and resolution of design challenges.

Time:
July 9, 2024
10 AM CET / 1h30 PM IST

Venue:
Virtual

Sign Up

This site is protected by reCAPTCHA and the Google Privacy Policy and Terms of Service apply.

What You Will Learn

  • High-Performance Computing (HPC): provides knowledge
    to tackle efficiently complex EM computational problems
  • Parallel Computing: HPC breaks down complex tasks into smaller subtasks that can be concurrently executed
  • Scalability: Efficiently scaling computational resources as the size of the problem increases is crucial in HPC

Who should attend?

PCB Designers, Consumer Electronics Engineers, Systems Engineers,
Power Solutions Engineers, SI/PI Engineers, Product Design
Engineers, and Power Module Engineers

Speakers

David Twyman