New simulation capabilities in ANSYS 19 can evaluate radio frequency and microwave transmission and reception; signal and power integrity; and electromechanical systems and electronics cooling. Features include:
New radar cross section calculations within HFSS SBR+ solver
This capability is based on ANSYS’ industry-leading SBR+ method to predict far-field radar signatures for 3D target models. The powerful and accurate asymptotic methods of HFSS SBR+ allow users to solve these computationally large simulations rapidly, and will be a great asset for engineers designing advanced detection systems and stealth technology for the military and aerospace industries. In addition, the continued integration of the SBR+ technology into the ANSYS Electronics Desktop will enable comprehensive and accurate large-scale, near-field radar analysis for performing automotive radar simulation for advanced driver assistance systems and autonomous vehicle applications.
▶ Go to radar cross section and Scattering
Advanced electro-thermal analysis workflow
Electronic devices contain many more components — within a much smaller form factor — than ever before. Although advances have been made with smaller processor technologies to decrease power draw, a more accurate prediction of heat dissipation is still needed, and is as critical as the electrical design itself. It is now common practice to require thermal analysis with most layout designs for printed circuit boards. To address this analysis need, ANSYS has integrated the Icepak electronics cooling product directly into the Electronics Desktop. This advancement modernizes and enhances the user experience within the familiar electronics workflow. It opens new possibilities for component- and system-level multiphysics, automation and robust design. Icepak resides in the Electronics Desktop alongside HFSS, ANSYS Q3D Extractor and ANSYS Maxwell, enabling a smoother overall workflow with robust thermal analysis integrated with electromagnetic field simulations.
Automation and advanced multiphysics for electromechanical devices
ANSYS 19 offers an integrated, motor design tool kit and automated, motor efficiency maps to aid design setup and the post-processing of transient electromagnetic solutions. Maxwell has also been upgraded with a new capability to simulate the effects of the manufacturing process on electrical steel. The electromagnetic characteristics of electrical steel change as they go through the process of forming core laminations through mechanical or laser cutting, and these changes can affect the simulated performance of the device. With this capability, Maxwell ensures greater simulation accuracy of devices that utilize laminated cores, such as motors and transformers, and eliminates the need for manual calibration of the simulation with physical measurements.
Powerful chip-package-system analysis enhancements
The ANSYS chip-package-system (CPS) design flow supports end-to-end simulation of electronics systems comprised of printed circuit boards, integrated chip (IC) packages, connectors and IC sockets. ANSYS delivers significant enhancements to its electrical layout-focused interface, including an advanced chip-package model transient circuit simulation and the ability to include IBIS-AMI models within HFSS layout and import of native Gerber file formats. ANSYS’ unique, layout assembly capability can now perform transient and statistical eye circuit simulation directly from the layout.
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