ANSYS HFSS SBR+ Enhancements for Automotive Radar Analysis
New capabilities evaluate the radar environment and radar antenna interaction when installed on the vehicle. Our customer-proven technology simulates complex driving scenarios that include busy intersections, multiple cars, trucks, pedestrians, streetlights and lampposts. And, to help you accelerate the solve time for thousands of these complex scenarios, we’ve added lightweight geometry modeling, efficient ray shooting technologies, accelerated Doppler processing, S-parameter coupling with transmit and receive selection and new, large-scale distributed computing.
▶ Go to Automotive Radar
Radar signature analysis of large targets
This capability is based on ANSYS’ industry-leading, shooting-and-bouncing-ray-plus (SBR+) method to predict far-field radar signatures for 3D target models. The powerful and accurate asymptotic methods allow you to solve computationally large simulations rapidly, and will be a great asset for engineers designing advanced detection systems and stealth technology for the defense and aerospace industries.
▶ Go to Radar Cross Section Scattering
Powerful Chip-Package-System (CPS) Analysis Enhancements
The ANSYS chip-package-system (CPS) design flow uses advanced modeling and proven simulation technologies to enable an intelligent, integrated, chip-aware system design flow to solve power integrity, signal integrity, electromagnetic interference and electrostatic discharge problems. In this release, we've added a new stackup wizard to ANSYS SIwave that allows for easy definition and exploration of PCB stackup layers and impedances. The PCB stackup is the substrate upon which all design components are assembled. A poorly designed PCB stackup with inappropriately selected materials can degrade the electrical performance of signal transmission, power delivery, manufacturability and the long-term reliability of the design. This new feature greatly enhances the accuracy and ease with which a designer can evaluate the PCB design performance.
▶ Go to Signal Integrity
Advanced electrothermal analysis workflow
Electronic devices contain many more components — within a much smaller form factor — than ever before. Although advances have been made with smaller processor technologies to decrease power draw, a more accurate prediction of heat dissipation is still needed, and is as critical as the electrical design itself. It is now common practice to require thermal analysis with most layout designs for printed circuit boards. To address this analysis need, ANSYS has integrated the Icepak electronics cooling product directly into the Electronics Desktop. This advancement modernizes and enhances the user experience within the familiar electronics workflow. It opens new possibilities for component- and system-level multiphysics, automation and robust design. Icepak resides in the Electronics Desktop alongside HFSS, ANSYS Q3D Extractor and ANSYS Maxwell, enabling a smoother overall workflow with robust thermal analysis integrated with electromagnetic field simulations.
▶ Go to Icepak
Advanced multiphysics and integrated systems simulation for electromechaincal design
ANSYS Maxwell offers an integrated, motor design tool kit and automated motor efficiency maps to aid design setup and the post-processing of transient electromagnetic solutions. Upgrades include a new capability for evaluating the effects of the manufacturing process on electrical steel, which ensures greater accuracy when simulating devices that utilize laminated cores, such as motors and transformers. Maxwell is also enhanced with powerful circuit and system modeling features for the design of power electronic systems. This new integrated feature unites circuit simulation with block diagrams, state machines and VHDL-AMS to evaluate the complete power electronics system, including circuit, control and electromechanical devices in a single environment.
▶ Go to Maxwell
