ANSYS HFSS SBR+ enhancements for automotive radar analysis
Analyze complex automotive radar driving scenarios using the powerful and accurate methods of HFSS SBR+. Users can solve advanced automotive ADAS radar systems, understand the response and capture the scenario’s complex radar profile. New features include SBR+ driving mode, parametric antenna sources with far-field overlay, improved frequency sweeps and improved, large-model user interface (UI) responsiveness and meshing.
▶ Go to Automotive Radar
Radar signature analysis of large targets
This capability is based on ANSYS’ industry-leading, shooting-and-bouncing-ray-plus (SBR+) method to predict far-field radar signatures for 3D target models. The powerful and accurate asymptotic methods allow users to solve computationally large simulations rapidly, and will be a great asset for engineers designing advanced detection systems and stealth technology for the defense and aerospace industries.
▶ Go to Radar Cross Section Scattering
Powerful chip-package-system (CPS) analysis enhancements
The ANSYS CPS design flow supports end-to-end simulation of electronics systems comprised of printed circuit boards, IC packages, connectors and IC sockets New hybrid simulation techniques allow users to define 3D regions within ANSYS SIwave, using the speed and capacity of SIwave for full-board simulation and capability to define specific regions of the board that require the 3D accuracy and rigor of ANSYS HFSS. These new techniques raise the bar for PCB analysis and simulation.
▶ Go to Signal Integrity
Advanced electro-thermal analysis workflow
Electronic devices contain many more components — within a much smaller form factor — than ever before. Although advances have been made with smaller processor technologies to decrease power draw, a more accurate prediction of heat dissipation is still needed, and is as critical as the electrical design itself. It is now common practice to require thermal analysis with most layout designs for printed circuit boards. To address this analysis need, ANSYS has integrated the Icepak electronics cooling product directly into the Electronics Desktop. This advancement modernizes and enhances the user experience within the familiar electronics workflow. It opens new possibilities for component- and system-level multiphysics, automation and robust design. Icepak resides in the Electronics Desktop alongside HFSS, ANSYS Q3D Extractor and ANSYS Maxwell, enabling a smoother overall workflow with robust thermal analysis integrated with electromagnetic field simulations.
▶ Go to Icepak
Advanced multiphysics and integrated systems simulation for electromechaincal design
ANSYS Maxwell offers an integrated, motor design tool kit and automated motor efficiency maps to aid design setup and the post-processing of transient electromagnetic solutions. Upgrades include a new capability for evaluating the effects of the manufacturing process on electrical steel, which ensures greater accuracy when simulating devices that utilize laminated cores, such as motors and transformers. Maxwell is also enhanced with powerful circuit and system modeling features for the design of power electronic systems. This new integrated feature unites circuit simulation with block diagrams, state machines and VHDL-AMS to evaluate the complete power electronics system, including circuit, control and electromechanical devices in a single environment.
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