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DATE: 09/22/2016

Ansys and TSMC Empower Chip Manufacturers to Design Cutting-Edge Multi-Die Chip-Package Systems

TSMC enables Ansys solutions for InFO reference flows to create reliable electronic products

PITTSBURGH, September 22, 2016 – As the number of smart, connected electronic devices grow, manufacturers of mobile, networking, automotive, industrial automation and healthcare applications need to design high performing and reliable products at a lower cost. To meet these growing demands, TSMC and Ansys are collaborating to enhance and deliver the most comprehensive suite of design solutions for TSMC’s wafer-scale Integrated InFO packaging technology.

By working together, TSMC and Ansys have enabled Ansys solutions for a variety of multi-die analyses including extraction, power and reliability, signal and power integrity and thermal and electromagnetic interference. The design enablement allows mobile and IoT manufacturers to create cost-effective, thinner and highly reliable cutting-edge mobile and IoT products using Ansys’ fully validated integrated circuit and package-level solutions.

"Our collaboration with TSMC has enabled the delivery of comprehensive and validated power signal integrity and reliability solutions for InFO package technology within the market,” said John Lee, general manager, Ansys. "Ansys’ best in class engineering simulation solutions enable our mutual customers to innovate beyond chip to package and system-level designs for mobile and IoT applications."

"Through the intensive collaboration of both parties, we are able to address design considerations in reliability and power integrity for InFO technology," said Suk Lee, TSMC senior director, Design Infrastructure Marketing Division. "The enablement of Ansys solutions ensures their readiness, allowing customers to analyze and design reliable power delivery networks across chip, package and system."

About ANSYS, Inc.

Ansys brings clarity and insight to customers' most complex design challenges through fast, accurate and reliable engineering simulation. Our technology enables organizations ― no matter their industry ― to predict with confidence that their products will thrive in the real world. Customers trust our software to help ensure product integrity and drive business success through innovation. Founded in 1970, Ansys employs almost 3,000 professionals, many of them experts in engineering fields such as finite element analysis, computational fluid dynamics, electronics and electromagnetics, and design optimization. Headquartered south of Pittsburgh, Pennsylvania, U.S.A., Ansys has more than 75 strategic sales locations throughout the world with a network of channel partners in 40+ countries.

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