Workshop Track: Thermal Integrity & Reliability
Some of the major new challenges facing 2.5D/3-IC designers are the complex thermal and structural integrity multiphysics interactions that have a profound impact on product reliability. Ansys provides proven thermal and mechanical physics engines for multi-die analysis, with links to system-level boundary conditions (HTC).
Time:
June 23, 2025
3:00 PM - 5:00 PM PDT
Venue:
Moscone Center West
Room 2024, 2nd Floor Exhibit
Speakers:
Sumanth Suraneni, Nikhil Jayakumar - Amazon
Rajvi Shah, Emmanuel Chao, Santosh Santosh - Nvidia
Pritesh Johari, Arian Fanaian - Qualcomm
Ahsan Alam - Ansys
Jisoo Hwang, KiHun Ok, SoYoung Kim - Samsung