Workshop Track: 3D-IC Multiphysics
Multi-die designs have been adopted by leading companies for the many benefits they offer for integration density, cost, performance, and flexibility. However, they also present new challenges with complex multiphysics interactions in the areas of signal integrity (SI), power integrity (PI), photonics, and security that require new design solutions and analysis technologies.
Date/Time:
June 23, 2025
1 PM - 3 PM PST
Venue:
Moscone Center West
Room 2024, 2nd Floor Exhibit
Speakers:
Ping Ding, Guohua Zhou, Shineng Ma - Sanechips
Jiajun Zhao, Guifang Chen, Yuming, Sun Pengyue Yun - Shanghai Englame Intelligence Tech
Xinyuan Miao, Yongjie Zhu, Grant Zhang, Wayne Wu - PhotonEra
Mingyang Liu, Runjian Wang, Hengzhi Hu, Minglu Xu, Yue Heng, Long Kong - Hangzhou Zhicun (Witmem) Tech
Shuhei Yokota, Rikuu Hasegawa, Kazuki Monta, Takaaki Okidono, Takuji Miki, Makoto Nagata - Kobe University