
ANSYS Icepak |
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For more than a decade, leading companies around the world have relied on ANSYS Icepak to provide robust and powerful computational fluid dynamics (CFD) software for electronics thermal management. Based on the state-of-the-art ANSYS FLUENT CFD solver, ANSYS Icepak software has a streamlined user interface that speaks the language of electronics design engineers, enabling the rapid creation of models of complex electronic assemblies. The software automatically generates highly accurate, conformal meshes that represent the true shape of electronic components, and simulations include fluid flow and all modes of heat transfer - conduction, convection and radiation - for both steady-state and transient thermal-flow simulations. By predicting fluid flow and heat transfer at the component, board or system level, ANSYS Icepak improves design performance, reduces the need for physical prototypes and shortens time-to-market in the highly competitive electronics industry.
» ANSYS Icepak Brochure (PDF) |
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FeaturesIcepak Objects
ECAD/MCAD Interfaces
Flexible, Automatic Meshing
Robust Numerical Solutions
Results Visualization
SIwave Interface
Interface to Structural Simulation
Macros
Libraries
Add-on Modules
WebinarsAsk the Expert - Advanced Fan and Blower Modeling with the MRF Technique in ANSYS Icepak Visit the global webinar calendar to view on demand events or to attend additional live events. |