ANSYS Icepak

For more than a decade, leading companies around the world have relied on ANSYS Icepak to provide robust and powerful computational fluid dynamics (CFD) software for electronics thermal management. Based on the state-of-the-art ANSYS FLUENT CFD solver, ANSYS Icepak software has a streamlined user interface that speaks the language of electronics design engineers, enabling the rapid creation of models of complex electronic assemblies. The software automatically generates highly accurate, conformal meshes that represent the true shape of electronic components, and simulations include fluid flow and all modes of heat transfer - conduction, convection and radiation - for both steady-state and transient thermal-flow simulations. By predicting fluid flow and heat transfer at the component, board or system level, ANSYS Icepak improves design performance, reduces the need for physical prototypes and shortens time-to-market in the highly competitive electronics industry.

» ANSYS Icepak Brochure (PDF)
» Fluid Analysis Solutions Brochure (PDF)
» What’s New in ANSYS Icepak 12.1
» ANSYS 12.1 Capabilities Chart (PDF)

 
     

Features

Icepak Objects
Rapidly create models with smart objects

ECAD/MCAD Interfaces
Import both electronic and mechanical CAD data

Flexible, Automatic Meshing
Accurately represent complex geometry

Robust Numerical Solutions
State-of-the-art ANSYS FLUENT computational fluid dynamics (CFD) solver

Results Visualization
Generate meaningful graphics, animations and reports

SIwave Interface
Import the DC power distribution profile of printed circuit board layers

Interface to Structural Simulation
Export temperatures to ANSYS Workbench for a thermal-stress simulation

Macros
Automatically create common components

Libraries
Fans, heat sinks, packages, filters, TECs, and material properties

Add-on Modules
Modules provide parallel processing, geometry editing, and design optimization

Webinars

Visit the global webinar calendar to view on demand events or to attend additional live events.