Rapid Thermal Exploration for Electronics Design with Ansys Discovery and AEDT Icepak

Overview

The thermal performance of electronic devices is of increasing importance due to high power densities within these devices. High power densities may arise due to many power dissipating electrical components being mounted within a single device or due to high power requirements of certain components. This leads to high temperatures within the device which degrades its electrical performance and life cycle. In a worst-case scenario, temperature hot spots may lead to destruction of the device. Carrying out a thermal analysis early in the design phase allows engineers to make decisions for better thermal performance as early as possible. As development of the device evolves, more information about it is available and a thermal analysis of the detailed device allows engineers to make final thermal performance decisions prior to production. This webinar will illustrate how to carry out an early phase thermal analysis of an electronic device within Ansys Discovery. We will then transfer directly via one-click the model to Ansys Icepak for a more detailed analysis.

What Attendees Will Learn

• Early‑stage thermal setup and analysis in Ansys Discovery
• Simplified geometry and assumptions for fast thermal insights
• One‑click model transfer from Ansys Discovery to Ansys Icepak
• Model refinement and added detail for high‑fidelity Icepak analysis
• End‑to‑end workflow from concept exploration to detailed validation

Who Should Attend

Ansys Discovery users, AEDT Icepak users, Electronics and system design engineers, Thermal analysts, and simulation teams seeking faster thermal insights from early design through detailed validation.

Speaker

• Atte Focho
• Akash Sharma