Innovating Consumer Packaging with Ansys LS-DYNA

Overview

Packaging design is intertwined with both product and process, making it a multifaceted and complex design challenge at its core. 

Traditionally, packaging development relies on excessive safety margins or extensive physical trials, leading to unnecessary material use and having to pause production.  

Shifting consumer demands and legislative requirements, such as PPWR, pose new challenges where CPG companies must find new packaging solutions in record time. New materials and processes, less material use, package integrity for shipping, and reusability are non-trivial engineering problems.    

Learn about real applications where physics-based simulation with Ansys LS-DYNA can accelerate this transition and support innovation. Not only does simulation enable you to make informed decisions earlier in the design process, but it also lets you

• Start physical trials with more mature prototypes, lowering risk and reducing number of iterations
• Innovate by exploring more designs and configurations in less time at lower cost 
• Find the best solution and pinpoint the important parameters through optimization

We’ll demonstrate this with examples of packaging applications solved with Ansys LS-DYNA, including 

• Processing & Manufacturing – folding, filling, sealing, & forming
• Transport & Handling – drop test, crushing, 
• End use – accessibility & durability 

While diving into important aspects such as 

• Material modelling – paper, corrugate board, foam, and plastic
• Multi-step process chains with material history 
• Packaging content and multi-physics, including fitments, inserts, airbags, and internal loads 
• Democratized workflows, optimization and automation

The goal is to give you ideas and inspiration on how to take advantage of simulation in your packaging design. 

What Attendees Will Learn

• Learn what Ansys LS-DYNA can offer for manufacturing and testing of packaging
• Get inspired by simulation examples for manufacturing, handling, and use of packaging
• Packaging materials, paper, plastic, foam, corrugate, etc.
• See how to take advantage of multi-physics to include content and increased accuracy

Who Should Attend

Users that today use Ansys LS-DYNA for component or product analysis who wish to include packaging into the equation or anyone that is interested in what simulation with Ansys LS-DYNA can offer for consumer-packaged gods.

Speaker

• Marcus Gustavsson