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Electrothermal Analysis of PCBs in Air and Vacuum   

Join us for an insightful webinar showcasing a streamlined PCB electrothermal workflow − from DCIR simulation in Ansys HFSS 3D Layout and SIwave to thermal modeling in Ansys Icepak. Discover how solver coupling and temperature-dependent materials enhance thermal, power, and signal integrity accuracy.

Date/Time:
February 10, 2026
11 AM EST

Venue:
Virtual

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Overview

This webinar presents a comprehensive workflow for PCB electrothermal analysis, beginning with DCIR simulation in Ansys HFSS 3D Layout using the Anys SIwave software and extending to Ansys Icepak software for thermal modeling in vacuum conditions. The bidirectional coupling between the solvers captures the influence of temperature-dependent material properties, ensuring greater accuracy in thermal management, power integrity, and signal integrity predictions.

What Attendees Will Learn

  • Configure and run a DCIR simulation in HFSS 3D Layout with the SIwave solver
  • Set up and perform thermal simulations in Ansys Electronics Desktop (AEDT) using Icepak under vacuum conditions
  • Implement two-way electrothermal coupling within AEDT

Who Should Attend

  • Thermal Engineers, Mechanical Engineers, Electrical Engineers, Signal Integrity and Power Integrity Engineers

Speakers

  • Nicole Barrera
  • Manohar Raju

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