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Students get free access to world-class simulation software.
Connect with Ansys to explore how simulation can power your next breakthrough.
Discover how Ansys LS‑DYNA drop test simulation helps engineers in the consumer electronics and packaging industry reduce physical testing, optimize packaging, and protect products from real‑world handling loads.
Date/Time:
17th June 2026
11:00 AM IST
Venue:
Virtual
Unplanned drops, transportation shocks, and mechanical handling loads are major causes of failure in consumer electronics and packaged products. Predicting these events early is essential to reduce damage, cost, and late-stage redesigns. In this webinar, discover how Ansys LS-DYNA Drop Test solutions enable simulation-driven packaging design. Learn how virtual testing supports ISTA-compliant evaluations and protects products against real-world loads such as drops, clamping, and transportation handling. The session will highlight corrugated cardboard impact analysis, cushioning performance, and advanced material modelling for cardboard, paper, foam, metal, and glass, along with packaging optimization techniques for robust and cost-effective designs. Join us to drive confident, simulation-led packaging decisions using Ansys LS-DYNA.