Predicting Solder Joint Failure from Field and Test Data
Learn about that statistical methods used to track PCB field failures and how these methods are used in corresponding failure simulations during this upcoming webinar.
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About This Webinar
Printed Circuit Boards (PCBs) are susceptible to several known solder failure modes assessed using statistical methods. These methods often predict when test and field failures may occur during the product development process.
As such, it is crucial for engineers working on electronic products to have a solid understanding of the key statistical concepts to perform such assessments.
This webinar will cover the calculations used to track field failures and those used as a part of the corresponding failure simulation process. The simulation results and failure data discussed will be correlated using Weibull parametrization (we'll explain the WEIBULL.DIST function in Excel along the way).
These correlation studies illustrate how acceleration factors are calculated and used. We will also use these calculation methods to discuss the statistically significant sample size impact on test resolution.
What You Will Learn
- The statistical methods for running a 'test to pass' and how to perform a 'test to failure'
- The simulation software to predict and prevent PCB solder fatigue
- The rationale for test considerations
Speakers
Gil Sharon