Ansys 2026 R1: Ansys Sherlock and Electronics Reliability What’s New
Join this webinar to explore the top electronics reliability highlights in Ansys Sherlock 2026 R1.
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Date/Time:
April 28, 2026
11 AM EDT
Venue:
Virtual
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Overview
This session showcases new and enhanced capabilities that improve reliability prediction accuracy, streamline workflows, and accelerate design decision making. Attendees will learn how tighter Sherlock integration enables faster PCB stackup updates and focused design evaluation, while new thermal-mechanical workflows deliver deeper insight into solder joint fatigue and system-level reliability behavior.
What Attendees Will Learn
- Electronics reliability workflow enhancements in Ansys Sherlock
- Seamless Sherlock integration in Ansys Mechanical
- Thermal Rainflow Cycle Counting for fatigue analysis
- Thermal‑Mechanical BGA life prediction (full release)
- Enhanced reliability scoring and reporting
Who Should Attend
This webinar is ideal for electronics reliability engineers, PCB and packaging analysts, thermal‑mechanical simulation specialists, and CAE teams using Ansys Sherlock to improve durability predictions and design confidence.
Speakers
- Kelly Morgan - Applications Engineering, Sr Architect, Ansys
- Christian Frech - Product Marketing, Sr Staff, Ansys
