Skip to Main Content

 

White Paper

Chip-Package Co-analysis Using Ansys RedHawk-CPA

Ansys RedHawk-CPA is an integrated chip–package co-analysis solution that enables quick and accurate modeling of the package layout for inclusion in on-chip power integrity simulations using Ansys RedHawk. With RedHawk-CPA a designer can perform static IR drop analysis and AC hotspot analysis of the package layout following RedHawk static and dynamic analyses respectively. To ensure a reliable supply of power, and stable voltage levels at the transistor connection points, the entire system power delivery network (PDN) must be optimized and validated, including the impact of package on a chip.

 

SHARE THIS WHITE PAPER

Ansysができること

お問い合わせ

* = 必須項目

お問い合わせいただき、ありがとうございます。

当社はお客様の質問にお答えし、お客様とお話できることを楽しみにしています。Ansysの営業担当が折り返しご連絡いたします。

フッター画像