This live session series will cover multiple Ansys solutions including:
View the schedule below for the full list of topics along with the dates and register today.
Date: June 7th, 2023 - December, 2023
Venue: Virtual
Speaker: Kelly Morgan
Packaging simulations often require users to generate high-fidelity models to capture necessary failure modes. Recent enhancements in Ansys tools allow users to quickly create Package models using a variety of approaches, especially as it relates to package substrates. In this session, we will discuss best practices described in Package modeling and introduce the latest Trace modeling workflows (i.e., the complete 3D modeling of traces and vias). Along the way, we will comment on the role of submodeling to ensure that we create models that provide us with the desired accuracy level while remaining computationally efficient.
