Synopsys at Supercomputing

Name: Synopsys at Supercomputing
Start: 2030-01-01T05:00:00Z
End: 2030-01-02T05:00:00Z

Booth 3138

Experience the combined power of Synopsys— driving the future of engineering and semiconductor innovation. Visit our booth, #3138, to engage with our experts and attend informative theater and panel presentations.

Date/Location:
November 16-21, 2025
St. Louis Convention Center, St. Louis, MO

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Cutting-Edge HPC and AI: Shaping the Future of Engineering Simulation

Join us at SC25 to discover how the Ansys portfolio revolutionizes engineering simulation with cutting-edge HPC and AI solutions. Explore our high-performance computing capabilities—whether CPU or GPU enabled, on-premises or in the cloud—enhanced by AI. Witness our top solvers’ latest HPC benchmarking results across diverse hardware configurations, including Fluent, LS-DYNA, Mechanical, HFSS, and more.

Throughout the week of SC25, Synopsys will feature in-booth panels and theater sessions, hands-on experiences, networking opportunities, and presentations from Ansys Technology Partners.

Don’t miss this opportunity to see firsthand how Synopsys, supported by our partners, drives performance and innovation in engineering simulation.

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Highlights

Booth Theatre Schedule

Tuesday - November 18

Session Title & Abstract	Time	Presenter Name & Title
Cloud Computing for Engineering Simulation Abstract: This panel will examine how cloud computing is transforming engineering simulation—enabling flexible, on-demand HPC resources, AI integration, and cloud-native workflows. Experts will share the latest trends, practical strategies, and real-world best practices for managing CAE data and bridging on-premises and cloud environments.	11:00 am-11:30 am	Panel Lead: David Freed, Sr. Director R&D, Synopsys Panelists: Sandeep Sovani, Global Head of GTM for Engineering Simulation in the Cloud, AWS Joe Greenseid, Principal Product Manager HPC/AI, Microsoft Srinivas Tadepalli, WW Head of GTM, Industrial Engineering, NVIDIA Derek McCoy, Vice President of the Americas, Rescale
Revolutionizing Simulation with Artificial Intelligence Abstract: This panel will explore the convergence of HPC, AI, and engineering simulation—examining emerging opportunities, challenges, and their transformative impact on product development workflows. Attendees will gain practical insights and strategies to harness these technologies for greater simulation performance, efficiency, and innovation.	1:00 pm-1:30 pm	Panel Lead: Andy Byers, Sr. Director Strategic Partnerships, Synopsys Panelists: Emily Miller, Global GTM Lead, AI and HPC, Accenture Joe Tostenrude, Principal Technical Program Manager, Microsoft Neil Ashton, Distinguished Engineer, Product Architect, NVIDIA
Three-Dimensional Two-Phase CFD Modeling and Experimental Validation of Skived-Fin Cold Plates Abstract: This study showcases how advanced 3D two-phase CFD modeling can accurately predict and optimize the performance of skived-fin cold plates for high-power electronics cooling. Validated against extensive experimental data, the simulations captured key thermal and flow characteristics across multiple geometries and conditions. The results highlight CFD’s superior accuracy over empirical methods—proving it to be a powerful engineering tool for designing next-generation, high-efficiency two-phase cooling solutions.	3:00 pm-3:30 pm	Mohammad Ahmadian Elmi, Ph.D., Villanova University
Boosting Productivity with Ansys RedHawk-SC and Azure NetApp Files Intelligent Data Infrastructure Abstract: Discover how integrating Ansys Access with Azure NetApp Files (ANF) is revolutionizing cloud-based engineering simulations. This session will detail how organizations can harness enterprise-grade storage performance, seamless scalability, and simplified deployment to supercharge Ansys RedHawk-SC workloads on Microsoft Azure.	4:00 pm - 4:30 pm	Andy Chan, Principal Product Manager- Azure NetApp Files, Net App

Wednesday - November 19

Session Title & Abstract	Time:	Presenter's Name & Title
Building the Future of Energy-Efficient HPC Data Centers Abstract: This panel will highlight real-world results from high-density deployments, including energy, space, and TCO improvements. Hear panelists’ insights on how CAE and simulation tools, including digital twins, can predict, optimize, and validate cooling and power strategies. The session will also highlight the challenges and opportunities in deploying ultra-dense compute racks, from thermal management to sustainability goals.	11:00 am-11:30 am	Panel Lead: Viral Gandhi, Sr. Manager Application Engineering, Synopsys Panelist: Ali Heydari, Technical Director & Distinguished Engineer, NVIDIA Chris Jones, Senior Director, AI Platforms, Microsoft Dr. Kashif Nawaz, Section Head, ORNL Steve Blackwell, VP of Engineering, Vertiv
How Synopsys Verification Continuum Enabled Rebellions’ 5-Week Silicon-to-Live Demo Success Abstracts: Rebellions, a fabless startup developing inference-oriented NPU SoCs for data centers, rapidly launched its REBEL_Q multi-die NPU—achieving full bring-up and live demo just five weeks after the first silicon arrival through a fully prepared full-stack software. By leveraging Synopsys VCS, ZeBu, Virtualizer, and the Verification Continuum, the team accelerated pre-silicon validation and enabled seamless hardware–software co-development across on-prem and cloud platforms.	1:00 pm-1:30 pm	Sanggyu Park, Verification Leader, Rebellions
Future Trends in HPC for Engineering Simulation Abstract: This panel will explore cutting-edge technologies and evolving architectures shaping the future of high-performance computing (HPC) in engineering simulation. Topics will include accelerated computing, exascale readiness, and cross-platform support, as well as the rising importance of sustainability in HPC, ranging from energy-efficient hardware to green data center initiatives.	2:00 pm-2:30 pm	Panel Lead: Wim Slagter, Sr. Director Partner Programs, Synopsys Panelist: Dave Kepczynski, Global Chief Digital Transformation, Product Development, Ford Todd Simons, HPC SME, Rolls-Royce Rick Knoechel, Global Strategy Lead, Automotive & Discrete Mfg., AMD Tony DeVarco, Director, HPC/AI and Manufacturing Vertical, HPE
Ascend HPC Lab: Your On-Ramp to GPU-Powered Innovation Abstract: The Ascend HPC Lab enables organizations to evaluate and optimize GPU-based workloads, including AI training, machine learning inference, and advanced visualization in a flexible, hardware-agnostic environment. Through real-world benchmarking, users can compare CPU and GPU acceleration, validate solver performance, and identify optimal configurations before scaling. You'll hear how Clarios, a global leader in advanced energy storage solutions, leveraged this model to safely explore cloud-based HPC environments.	3:30 pm - 4:00 pm	Jeff Reddin, Vice President, Oakwood Systems
HPC Advancements in Mechanical APDL This talk highlights recent high-performance computing (HPC) advancements in Ansys Mechanical APDL, including new parallel solver technologies, GPU acceleration strategies, and hybrid CPU-GPU workflows designed for large-scale finite element analysis. Attendees will gain insights into real benchmark results and algorithmic innovations driving faster engineering simulations.	4:30 pm - 5:00 pm	Jeff Beisheim, Distinguished Engineer, Synopsys

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