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2022 R2: What’s New in Ansys Signal & Power Integrity

Learn about the latest updates and newest functionality in Ansys Signal and Power Integrity. This webinar will describe the new features & capabilities of Ansys SIwave in detail, including new workflows for bending PCBs and creating encrypted 3D layouts.

Time:
August 9, 2022
11 am EST

Venue:
Virtual

Register Today


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About this Event

The 2022 R2 Ansys Signal and Power Integrity release introduces significant simulation improvements for electronic printed circuit boards, IC packages, and interposers. Ansys SIwave delivers new features, including a new blending algorithm for AC-DC transition, enhancements for DDR Wizard, which now supports IBIS AMI models, RLCG matrix reduction operations in CPA, and improvements to SI Xplorer and Auto HFSS Regions. HFSS 3D Layout brings support for rigid-flex cable systems and support for encrypted 3D Layout components.

What You Will Learn

  • How to use the new rigid-flex workflow to bend PCBs
  • How to create encrypted 3D Layout components
  • How to use the new features in SIwave and CPA such as wideband PSPICE model generation

Speaker

Juliano Mologni

Juliano Mologni

Juliano is the SI/PI and EMI/EMC Product Manager at ANSYS. He has over 20 years of experience in computational electromagnetics and is the author of multiple patents and more than 60 journal and conference papers. Juliano has been involved in a plethora of RF and EMC projects with top Automotive, A&D, Appliances and High Tech companies. He holds a BSc degree in Telecommunication Engineering, an MSc degree in Microelectronics and authored a PhD thesis on Automotive EMC and Signal Integrity.