2021 R2 introduces significant improvements to electronics thermal management analyses. From native Joule heating to significant improvements in MCAD geometry handling, mesh and solution processing lead to productivity gains for Icepak. These improvements will enable thermal engineers to solve complex system-level problems with faster turn-around-times.
Register to learn more about these and other features that will improve your thermal management capabilities:
- Joule heating analysis solving tightly coupled electro-thermal problems with static or transient excitations.
- Reduced Order Model simplified setup for complex problems involving varying load and flow rate conditions.
- Icepak solver and performance improvements enabling 10 to 100 faster times for MCAD geometry loading, meshing, solver initialization, and solving.