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Ansys 2021 R2: Signal and Power Integrity Update

This webinar showcases Ansys SIwave’s significant simulation improvements for electronic printed circuit boards and IC packages in the new 2021 R2 release.

Time:
August 5, 2021
11 AM EDT / 4 PM BST / 8:30 PM IST

Venue:
Online


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About this Webinar

The 2021 R2 Signal and Power Integrity release introduces significant simulation improvements for electronic printed circuit boards and IC packages. Ansys SIwave delivers new features, including support for temperature-dependent materials in AC solver and an updated thermal link between Ansys Icepak and Ansys Electronics Desktop. Additionally, SI Xplorer will help PCB designers define stackup and optimize transitions such as vias. 

 

What attendees will learn

This webinar spotlights substantial advancements in SIwave.

  • Learn how SI Xplorer combines Stackup Wizard and Via Wizard functionality into one tool kit.
  • Understand how support for temperature-dependent materials in SIwave’s AC solver enables users to modify the conductivity of plane and traces and derate the response of dynamic capacitors. 
  • Discover how the updated thermal link provides a more robust electrothermal design using Icepak from Electronics Desktop.