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Miniaturization and Photonic Integration: A Cross-Industry Transformation

This webinar is part of a three part Webinar to Workshop series that is intended to lead the attendees from a high level webinar to a semi-interactive virtual deep dive session and then on to a fully hands on virtual workshop. 

This webinar will be a semi-live prerecorded session. In which the presentation will be recorded prior to the event, but we will host live Q&A at the end of the session.

Date/Time:
May 13, 2026
Session One: 9 AM EDT
Session Two: 1 PM EDT

Venue:
Virtual

Session One: 9:00 AM EDT

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Session Two: 1:00 PM EDT

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Overview

The drive toward miniaturization and photonic integration is accelerating innovation across industries such as data communications, telecommunications, healthcare, and automotive. A critical challenge in this transformation is the efficient coupling of optical signals from fiber to photonic chips—a process that directly impacts device performance, manufacturing yield, and overall system reliability. This webinar introduces a comprehensive simulation workflow for optical fiber-to-chip coupling using microlenses and edge couplers, leveraging industry-leading tools such as Lumerical MODE and FDTD, and Zemax OpticStudio. Attendees will discover how simulation can be used to accurately model coupling efficiency under realistic alignment conditions, explore the impact of misalignments and custom optical components, and learn how advanced modeling can inform robust, cost-effective design decisions. The session will highlight practical results, customization options, and strategies for optimizing coupling in next-generation photonic systems.

What Attendees Will Learn

  • Understand the importance of fiber-to-chip coupling and alignment challenges in photonic integration and how they affect performance and reliability in key industries.
  • Gain insight into a simulation workflow for modeling optical coupling using Lumerical MODE, FDTD, and Zemax OpticStudio, including the analysis of microlens and edge coupler configurations.
  • Recognize how misalignment and packaging variations can be modeled and analyzed to assess power loss, inform tolerancing studies, and guide design improvements.
  • Appreciate the value of integrating multiple simulation tools to achieve accurate, realistic results for complex photonic packaging scenarios.
  • Explore how customizable modeling methodologies can help optimize coupling efficiency, reduce costs, and support innovation in the development of miniaturized, integrated photonic devices.

Who Should Attend

  • Optical Engineers
  • Photonic Engineers
  • Photonic System Designers

Speaker

  • Fatema Chowdhurry

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