We’re covering the latest technology trends researched by Ansys experts
The semiconductor and electronics industries collide as 3D-IC technology, enabling companies to design differentiating bespoke silicon. The advent of 3D-IC requires more physics domains in a multiphysics challenge requiring new tools and approaches to building electronic design teams. At DAC 2022, we’ll share the latest technologies for 5nm power integrity signoff, dynamic voltage drop coverage, electrothermal signoff for chips & PCBs, advanced 2.5D/3D packaging, and photonic design.