Share:

ANSYS Completes Latest Certification on TSMC 5nm FinFET Process Technology

TSMC and ANSYS enable power integrity and reliability multiphysics solutions for next-generation applications

PITTSBURGH, April 22, 2019 – Through new certifications and a comprehensive suite of semiconductor design solutions, TSMC and ANSYS (NASDAQ: ANSS) empower mutual customers to meet increasing demands for next-generation of innovations in mobile, networking, 5G, artificial intelligence (AI), cloud and data center applications.

Advancements in these cutting-edge applications are pushing the limits of performance within a power and thermal constrained environment. AI applications — including training and inferencing data sets in the cloud and edge — require power-hungry, high-performance processors with increased functionality.

TSMC certifies ANSYS® RedHawk™ and ANSYS® Totem™ multiphysics solutions on its latest 5nm FinFET process technology. The certifications include extraction, power integrity and reliability, signal electromigration (signal EM) and thermal reliability analysis, and statistical EM budgeting (SEB) analysis. Optimized for mobile and HPC applications, the certifications enable low power design solutions for TSMC’s most advanced process technology.

"ANSYS' solutions are certified on TSMC industry-leading 5nm FinFET, 7nm, and 7nm FinFET Plus processes, enabling our mutual customers to verify and validate their designs with increased confidence to address growing performance, reliability and power challenges," said Suk Lee, senior director, design infrastructure management division at TSMC. "Our fruitful collaboration with ANSYS results in empowering customers to achieve their successes in high-growth markets with primary focuses on leading edge AI, data center, cloud and mobile applications."

"Multiphysics analysis enables silicon success for 7nm and below FinFET designs," said John Lee, general manager at ANSYS. "We are proud to collaborate with TSMC to enable our mutual customers to achieve their power, performance, area and reliability goals with our solutions."

About ANSYS, Inc.
If you've ever seen a rocket launch, flown on an airplane, driven a car, used a computer, touched a mobile device, crossed a bridge or put on wearable technology, chances are you've used a product where ANSYS software played a critical role in its creation. ANSYS is the global leader in engineering simulation. Through our strategy of Pervasive Engineering Simulation, we help the world's most innovative companies deliver radically better products to their customers. By offering the best and broadest portfolio of engineering simulation software, we help them solve the most complex design challenges and create products limited only by imagination. Founded in 1970, ANSYS is headquartered south of Pittsburgh, Pennsylvania, U.S.A., Visit www.ansys.com for more information.

ANSYS and any and all ANSYS, Inc. brand, product, service and feature names, logos and slogans are registered trademarks or trademarks of ANSYS, Inc. or its subsidiaries in the United States or other countries. All other brand, product, service and feature names or trademarks are the property of their respective owners.

ANSS-C

Contact

Media
Mary Kate Joyce
724.820.4368
marykate.joyce@ansys.com

Investors
Annette Arribas, IRC
724.820.3700
annette.arribas@ansys.com


 

click below to start a conversation with ANSYS

Contact Us
Contact Us
Contact