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2018 ANSYS Electronics Conference

December 11, 2018

09.00am - 05.00pm

REGISTER ›

Venue:
Aloft Bengaluru Cessna Business Park,  
Cessna Business Park,
Sarjapur - Marathahalli Outer Ring Road, Post,
Kadubeesanahalli, Bellandur,
Bengaluru, Karnataka 560103, India

Contact:

Welcome to the 2018 ANSYS Electronics Conference. 

Increasing demand for smart electronic devices is driving integration and further miniaturization of integrated circuit (IC) technology. Interacting physics arising from shrinking geometries, especially in FinFETs, stacked-die and emerging 3D-IC architectures, result in power integrity and reliability-related design challenges. By simulating electromigration, thermal effects and electrostatic discharge phenomena, you can verify the power noise integrity and reliability of the most complex ICs. ANSYS simulation and modeling tools offer you early power budgeting analysis for high-impact design decisions and foundry-certified accuracy needed for IC sign-off.

Also, today's world of high performance electronics and advanced electrification systems, the effects of electromagnetic fields on circuits and systems cannot be ignored. ANSYS software can uniquely simulate electromagnetic performance across component, circuit and system design, and can evaluate signal integrity, power integrity, RF antenna, thermal and mechanical effects. This unmatched electromagnetic-centric design flow helps you achieve first-pass system design success for advanced communication systems including 5G, ADAS, high-speed electronic devices, electromechanical components and power electronics systems.

Join ANSYS for an informative conference and share your creative ideas with your peers and ANSYS Users at the 2018 ANSYS Electronics Conference to be held at Bengaluru (December 11, 2018). You will get the chance to showcase your organization while learning how other organizations are leveraging the power of simulation.

At the Conference, you can expect to collaborate, share information and learn how to optimize your use of engineering tools, data, and business processes.

AGENDA

Time Particulars
09:00 am - 09:30 am Registration
09:30 am - 09:40 am Welcome Note - Rafiq Somani, Area Vice President - South Asia Pacific and Middle East, ANSYS Inc
09:40 am - 10:20 am Keynote - Accelerating Smart Electronic Product Development with Big Data & Machine Learning, John Lee, GM & VP, ANSYS Inc 
10:20 am - 11:00 am Keynote - Chandra Kypa, Director & Head of Design Enabling and Services, Infineon Technologies
11:00 am - 11:20 am Tea Break
11:20 am - 11:55 am Electromagnetics Modeling for Autonomy, Mobility and IIoT , Shitalkumar Joshi, ANSYS India
11:55 am - 12:30 pm ANSYS Electronic Design WorkFlows for ADAS, Mobile and HPC Designs 
12:30 pm - 01:30 pm Lunch
 
TRACK 1 - Semiconductor
TRACK 2 - Electronic System
01:30 pm - 02:00 pm Power Grid Analysis for Huge Graphics Designs Using Big-Data Elastic-Compute Solution, Basavaraj Kanthi & others, Intel Inc
Milimeter Wave Imaging Radar for ADAS Applications, Alok Joshi, Steredian Semiconductors 
02:00 pm - 02:30 pm Fast and Accurate Simulation of Dynamic-Voltage-Drop Impact on Timing, Palkesh Jain & Mahesh Yatagiri, Qualcomm Inc Demystifying Via Impedance for High Speed Channels for Next Generation Servers, Sukumar Muthusamy and Mallikarjun Vasa, Dell
02:30 pm - 03:00 pm High Coverage, Multivariable Build Quality Metrics in Power Integrity Signoff, Vivekanandan Srinivasan & Akshat Mathur, Nvidia Corp  Improving Productivity Using Automation for Signal Integrity Studies of High Speed Interfaces 
03:00 pm - 03:15 pm Tea Break
03:15 pm - 03:45 pm Fast PDN Sign-off By Slicing Long-Vectors in RedHawk-Seascape, Udayakumar Yedakuppam & Soenke Grimpen, Infineon Technologies  Advances in Electromagnatic simulations, ANSYS 
03:45 pm - 04:15 pm Power and Reliability Analysis for Next Generation InFO & CoWoS Style Designs, Abhishek Chakraborty & Dravit Rana, MediaTek Inc  Chip-Package Co-Analysis Using, ANSYS 
04:15 pm - 04:45 pm Power Integrity and Reliability Sign-off for Next-Generation ADAS Automotive Designs, Vanpreet Kaur & Govind Pal, STMicroelectronics Thermal reliability of electronics components, Nikhil Patil, Qualcomm
04:45 pm - 05:00 pm Lucky Draw and Closing