Temperature cycling of printed circuit boards can cause failures due to solder fatigue. This is a thermomechanical process that happens due to a mismatch in the coefficients of thermal expansion (CTEs) between the PCB and the components. Too often, the thermal and mechanical simulations are done separately: Thermal engineers perform the CFD analysis in ANSYS Icepack after the mechanical reliability team has finished with the model.
This webinar will demonstrate an automated process of thermal modeling of printed circuit boards. It will present a workflow to translate ECAD data to a thermal and mechanical model in ANSYS Icepack, followed by the transfer of results into ANSYS Sherlock for solder fatigue analysis.