Improve Collaboration, Reduce Engineering Time, and Increase Sales with ANSYS HFSS 3D Components!
More and more design engineers want to perform full-wave EM analysis of their high frequency products to fully validate performance and catch potential problems before the first hardware prototype, but today are held back by the lack of 3D component models.
At the 2019 International Microwave Symposium, we will be showcasing our revolutionary, new capability that enables component suppliers to share HFSS 3D models without compromising intellectual property.
Join ANSYS and our partner, Modelithics, Inc., for a special session where you will discover how early adopters are already advancing collaboration through 3D Components and learn how you can provide your customers with HFSS simulation-ready models, giving them the valuable edge of first-pass design success.
Enjoy coffee and conversation with engineering professionals in a casual environment ideal for networking. This event is a great opportunity to make connections and exchange ideas with others who work in your industry. Pre-registration is required.
Learn more about ANSYS at Booth 818