Growing market needs for electrification, connectivity on the go, advanced driver assistance systems (ADAS), and ultimately autonomous driving, are creating newer requirements and greater challenges for automotive electronics systems. Automotive electronics, unlike consumer electronics, must operate in very harsh environments for extended periods of time. They must be safe and highly reliable, with a zero-field failure rate over a lifespan of 10 to 15 years. Thermal performance and reliability is critical for these high-power, intelligent electronics, which often include sensors and heterogeneous packaging systems.
Attend this webinar to learn how multiphysics simulations can address key reliability requirements for automotive electronics with thermal, thermal-aware electromigration (EM) and thermal-induced stress analyses across the spectrum of chip, package and system.
Karthik Srinivasan, Senior Corporate AE Manager, Analog & Mixed Signal Products, Semiconductor Business Unit, ANSYS Inc.
Karthik is currently working as a Senior Corporate AE Manager, Analog & Mixed Signal Products at the Semiconductor Business Unit of ANSYS Inc. His work focuses on product planning for analog/nixed signal simulation products and field AE support. His research interests include power estimation, power noise, reliability and thermal analysis for chip-package and system. He joined Apache Design Solutions in 2006 and has taken several roles as part of the field AE team. He received a B.S. in electronics and telecommunication engineering from the University of Madras, India, and an M.S. in electrical engineering from the State University of New York, Buffalo, in 2003 and 2005, respectively.