Thermal Analysis of High Power Pulse Laser Module

Thermal management is very critical in laser diode packaging, especially for a high power laser module, because the excessive heat generated in the laser diode can result in thermally induced optical failures, and mechanical failures like micro crack in tunnel junction due to high thermal stress, and also lead to long term reliability problems due to laser chip degradation and joint fatigue. In this paper, thermal analysis has been conducted on a 3-D finite element model of a high power pulse laser module to evaluate the thermal performance of different chip bonding media, different carrier and main substrate materials, for both steady state of the module and transient analysis of pulses of nanoseconds. Thermal stress is also calculated for different bonding media for comparison. A program using APDL of ANSYS has been developed for the analysis that helps the laser module packaging material selection and process evaluation.

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