Today’s electronic devices, including their IC packages and printed circuit boards (PCBs), have smaller footprints and unique power requirements. Inadequate designs could lead to overheating components that degrade product reliability and cause costly redesigns. Engineers rely on ANSYS Icepak to validate thermal designs and ensure adequate cooling before building hardware.
Icepak accurately predicts airflow, temperature and heat transfer in a wide variety of electronic and power electronic components and PCBs. It can also perform thermal analysis of system- level applications such as data centers, computers and telecommunications equipment. Icepak enables you to test conceptual designs under operating conditions that might be impractical to duplicate with physical testing, and can give you access to data at locations that might be physically inaccessible on an actual component.
ANSYS Icepak uses the renowned ANSYS Fluent computational fluid dynamics (CFD) solver engine for accurate thermal and fluid flow calculations. Both multigrid and pressure-based solver formulations are available, providing quick and robust calculations. The solution also provides meshing algorithms for complex geometries, including both multiblock and unstructured hex-dominant meshing. While the meshing process is fully automated, you can also customize it to refine the mesh and optimize the trade-off between computational cost and solution accuracy.
See how our customers are using our software:
Ruggedized Systems: Cool and Collected
To meet demanding military specifications for mobile and interconnected surveillance, communications and operational devices, Kontron uses sophisticated thermal simulation to balance size, weight, power and cooling (SWaP-C) trade-offs for 'ruggedized' modular chassis that support customized solutions for mission-critical operations.View Case Study
Keeping the Block Cool
As cars become more complex, companies that manufacture the supporting electronic systems must make them reliable and safe. Automotive electronics system manufacturer Kyungshin improved the thermal management of its smart junction blocks while cutting production time by 80 percent and costs by over 50 percent.View Case Study