Photonic Devices and Optical I/O Design
Ansys, part of Synopsys, enables physics accurate modeling and optimization of PIC devices and optical coupling—capturing loss, alignment sensitivity, thermal drift, and packaging effects to ensure robust performance at scale.
Thermal-Aware and Multiphysics CPO Design
Across PIC, electronics and packaging, we deliver thermal‑aware design and multiphysics analysis to expose thermal crosstalk, stress effects, and performance drift early—before margins collapse at integration.
Electrical Robustness and Reliability
Our solutions enable signoff grade signal, power, EMIR, and ESD analysis in dense multi-die environments—capturing short reach electrical effects and electro optic interactions critical to reliable CPO operation.
System-Aware Multi-Die Integration
Enable system‑aware PIC/EIC co‑design and multi‑die integration using PDK‑centric, manufacturable models and reference workflows—preserving physics fidelity while scaling execution from early exploration through signoff.
