Skip to Main Content

 

White Paper

Chip-Package Co-analysis Using Ansys RedHawk-CPA

Ansys RedHawk-CPA is an integrated chip–package co-analysis solution that enables quick and accurate modeling of the package layout for inclusion in on-chip power integrity simulations using Ansys RedHawk. With RedHawk-CPA a designer can perform static IR drop analysis and AC hotspot analysis of the package layout following RedHawk static and dynamic analyses respectively. To ensure a reliable supply of power, and stable voltage levels at the transistor connection points, the entire system power delivery network (PDN) must be optimized and validated, including the impact of package on a chip.

 

SHARE THIS WHITE PAPER

查看 Ansys 的服務與產品

立即聯絡我們

* = 必填欄位

感謝您聯絡我們!

We’re here to answer your questions and look forward to speaking with you. A member of our Ansys sales team will contact you shortly.

Footer Image