Electromagnetic interference (EMI) is a common problem in the electronics sector, especially as IC devices continue to get smaller and customers expect everything to work faster. Having so many electronic components in small spaces increases the risk of EMI. Intel was looking for a way to simulate the interactions and interference of a whole server at once as the ultimate way of understanding their products.
Simulating an entire server at once had never been done before. To do so, Intel requested greater interoperability and functionality of HFSS, SIwave, and EMA3D Cable software in the following ways:
Over the course of two years, Ansys and EMA worked closely with Intel engineers to modify the EMA3D software, with validation by Intel at each step. They improved the meshing speed by substituting a voxel grid mesh instead of the traditional tetrahedra used by the finite element method, resulting in a forgiving mesh that can be completed much faster than before. To model the cables connecting PCBs, EMA3D combined two solvers: the solver for the 3D structure that uses the voxel grid mesh, and a solver based on multi-conductor transmission line theory for the cables. This combination yields a onedimensional line that shows the cable placement and a 2D cross section that reveals what's inside that one-dimensional line.
Intel engineers now have the ability to:
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