June 29, 2022
Come join Ansys at the IEEE Electromagnetic Compatibility, Signal, and Power Integrity Symposium this August 1-5 in Spokane, Washington.
This annual conference is organized by the Institute of Electrical and Electronics Engineers (IEEE) Electromagnetic Compatibility (EMC) Society, bringing together engineers and scientists focused on electromagnetic effects in system environments. Products, technologies, and research will be presented at the symposium to further enhance the knowledge and skills of professionals in the field.
Ansys and ElectroMagnetic Applications Inc., Ansys partner and author of the EMA3D Cable and EMA3D Charge electromagnetic solvers for electromagnetic interference (EMI) and charge accumulation simulation, will be in booth 415 and 413 to consult with you about your design needs and support you with electromagnetic solvers/simulators such as:
If you are interested in learning more about electromagnetic environments (EME), make sure to attend the “Ask the Experts” panel, where EMA’s Karen Burnham and other panelists will cover EME and other similar topics. Karen will also present her workshop paper, “Introduction to EMI Modeling Techniques,” during the “Hybrid Modeling Approaches” session, as well as present a demonstration on low-cost software-defined radio capabilities.
EMA will also have Grant Riley present “Cabling Simulation for Aerospace Applications.” In this talk, Riley will demonstrate how to use simulation and modeling tools to model common coupling scenarios of concern to an EMC engineer. He will also cover multiple implementation tasks, demonstrate complex harness modeling, and more.
Ansys has four decades of applied research and development incorporated in its EM solvers and has made many breakthroughs in novel numerical methods and mathematical techniques for computational electromagnetics. Come to the conference and meet with Ansys experts for help on your EMI/EMC and signal integrity/power integrity (SI/PI) design issues.