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High Tech Content & Webinar Series

Accelerate your High Tech Innovations and design for radio,
devices, network and data center with Ansys multiphysics solutions.

This dynamic content and webinar series showcases the past, present and future of mobile networking, and how the convergence of 5G, edge computing and artificial intelligence machine learning will change the industry landscape. Additionally, it illustrates the 3D Component Domain Decomposition Method workflow for the analysis of phased array antennas and also demonstrates handheld antennas.

On Demand Webinars

5G Systems

Ensure 5G Systems Integrity by Using Multiphysics Analysis of Chips, Packages and Systems

This presentation will discuss the various data paths in 5G systems and how Multiphysics analysis can help design these paths to allow for maximum data integrity.

Systematic Cybersecurity

Systematic Cybersecurity Threat Analysis and Risk Assessment

Ansys medini for Cybersecurity helps secure in-vehicle systems and substantially improves time to market for critical security-related functions. It addresses the increasing market needs for systematic analysis and assessment of security threats to cyber-physical systems, starting early in the system design phase.

Modeling Simulation

Modeling and Simulation of 5G Antenna System Innovations

Ansys has developed a breakthrough technology, known as 3D Component Domain Decomposition Method (3D Comp DDM), that enables the accurate and efficient simulation of antenna arrays. Whether solving complex, electrically large antenna arrays, or relatively simple antenna arrays, this technology enables fast simulation without compromising on accuracy. 

5G Design Innovation

5G Design Innovation Through Simulation

This presentation showcases the past, present and future of mobile networking, and how the convergence of 5G, edge computing and artificial intelligence machine learning will change the industry landscape. Modeling and simulation will drive this revolution—particularly in combining the physics of electromagnetics, optical, thermal, mechanical, and materials.

5G Connected Vehicle

5G and the Connected Vehicle

In this webinar, the advanced shooting and bouncing Ray (SBR+) method within Ansys HFSS will be presented as solution. We will address the placement of antennas, setup of moving trajectories and how to import models — including vehicles, areas of a street or parts of a city — to support your simulation. Additionally, critical post-processing capabilities and recommended solver settings will be discussed.

Placing Antennas

Placing Antennas with Ansys HFSS SBR+ Simulation

A live demonstration will spotlight how it can be combined in a hybrid simulation approach with finite-element boundary integral (FEBI) domains or reading in far-field or near-field sources. Additionally, key post-processing capabilities and recommended solver settings will be discussed.

Human Exposure 5G

Simulating Human Exposure to 5G Radiation

In this webinar, we provide an overview of the main challenges related to human exposure assessment to 5G electromagnetic fields, highlighting the growing importance of numerical approaches and their benefits compared to measurement. In particular, the capabilities of state-of-the-art simulation solvers will be demonstrated by showing examples of SAR and power density evaluation on realistic test cases.

3D Component Arrays

3D Component Arrays Demonstration

In this webinar, the numerical technique of the domain decomposition based on 3D components within Ansys HFSS will be showcased with key examples.

A live demo will spotlight the setup procedure and post-processing capabilities will be presented, illustrating how you can define individual excitation for every individual cell as a post-processing operation.

Exploring Ansys HFSS 3D

Exploring Ansys HFSS 3D Layout-Driven Assembly

Learn how to combine ECAD layout designs together, add mechanical CAD connectors or 3D component models in Ansys HFSS 3D Layout to accurately extract complex interconnect systems with 3D electromagnetic field simulation. This allows leading companies to break through the established silos of separate IC, package and board design and gain insight to the integrated IC-package-board design.

Optimizing Speed HFSS SIwave

Optimizing Speed with HFSS Regions in SIwave

This presentation compares the technique versus solely using Ansys HFSS, and explains how you can balance tradeoffs between accuracy, simulation speed, ease of use, and employing high-performance computing (HPC) options to solve 3D regions in parallel. Additionally, this webinar spotlights Ansys’ future plans for improving HFSS Regions in SIwave.

Introduction Ansys HFSS 3D

Introduction to Ansys HFSS 3D Layout

Learn how Ansys HFSS 3D Layout simplifies modeling of layered structures such as printed circuit boards (PCB) and high-speed components. HFSS 3D Layout is ideal for designers who work with layered geometry or layout high-speed components, including on-chip embedded passives, IC packages and PCB interconnects. 

Featured Content

Ansys 5G Mobile/UE Solutions

Ansys 5G Mobile/UE Solutions White Paper

Ansys simulation software for 5G provides a compelling set of design solutions from mobile user equipment to networks and beyond. Simulation applications include electronics thermal management, advanced RF front-end design, and radio desensitization and EMI issues in 5G Smartphones.

Ansys 5G Antenna Solutions

Ansys 5G Antenna Solutions White Paper

Designing 5G wireless systems is a huge undertaking. Antenna beamforming and beamsteering in 5G are key to improve the capacity and data rates for wireless applications. Massive MIMO, for instance, requires phased array antennas to be designed carefully to optimize the gain and ensure targeted coverage. Ansys tools are ideal for designing and simulating antennas, antenna-to-antenna coupling and environmental effects on signal propagation.

RFICs and SoCs for 5G Applications

Multiphysics Simulations for RFICs and SoCs for 5G Applications White Paper

Ansys multiphysics simulations simultaneously solve power, thermal, variability, timing, electromagnetics and reliability challenges across the spectrum of chip, package and system to promote first-time silicon and system success.

5G INTELLIGENT CONNECTIVITY

Engineering What’s Ahead: 5G INTELLIGENT CONNECTIVITY e-book

Find out how pioneers like Qualcomm and AMD are using simulation to address these critical market needs by downloading the e-book.

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