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Studenten erhalten kostenlosen Zugang zu erstklassiger Simulationssoftware.
Stellen Sie eine Verbindung mit Ansys her, um zu erfahren, wie Simulation Ihren nächsten Durchbruch vorantreiben kann.
In this latest installment of the year-long 3D-IC webinar series, Dr. Lang Lin will discuss the Thermal Integrity issues associated with 3D-IC designs. The presentation will cover thermal hotspots, mechanical stresses induced by thermal issues, and methods for capturing these problems with simulation and virtual prototyping, with a focus on designs that utilize silicon interposers.
Venue:
Virtual
Thermal integrity and thermal-induced mechanical issues are becoming essential for the new generation of 2.5D/3D-IC with closely packed chiplets on an interposer, package, and board due to strong cross-die thermal coupling. Traditionally, on-chip thermal sensors are placed on potential hotspots to detect real-time temperature to avoid thermal throttling via the Dynamic Thermal Management (DTM) technique. However, it is challenging to cover all hotspot locations of a complicated stacked-die system to place the sensors. This presentation will introduce the key technologies from Ansys to address pre-silicon thermal integrity simulation and mechanical stress analysis.
All 3D-IC designers
