Optimizing Thermal Designs with Ansys optiSLang & AEDT Icepak
During this webinar, we will demonstrate how optiSLang and AEDT Icepak can transform traditional thermal design workflows, using real-world examples to demonstrate their capabilities.
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During this webinar, we will demonstrate how optiSLang and AEDT Icepak can transform traditional thermal design workflows, using real-world examples to demonstrate their capabilities.
DATE/TIME:
August 12, 2025
11 AM IST
Venue:
Virtual
In the evolving landscape of electronics cooling, achieving optimal thermal performance is essential for reliability, efficiency, and cost-effectiveness. Ansys optiSLang, when coupled with AEDT Icepak, offers a robust, automated, and intelligent optimization workflow to enhance the thermal designs of electronic components and systems.
optiSLang facilitates parametric, sensitivity, and robust design optimization by leveraging advanced techniques, including response surface modeling, design of experiments (DOE), and global and local optimization algorithms. Instead of relying on costly and time-consuming solver evaluations during every iteration, pre-optimization is performed using the metamodel rather than the solver, which significantly accelerates the design exploration process. Generated metamodels can be used in subsequent optimization as a substitute for the physical solver.
Key advantages of using optiSLang with AEDT Icepak include:
In summary, this webinar will demonstrate how optiSLang and AEDT Icepak can transform traditional thermal design workflows, using real-world examples to demonstrate their capabilities.