Comprehensive Multiphysics Analysis Platform for 3D-IC Interposers
This webinar outlines the power integrity, thermal integrity, and signal integrity difficulties in 3D-IC design.
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This webinar outlines the power integrity, thermal integrity, and signal integrity difficulties in 3D-IC design.
This webinar introduces the Multiphysics requirements to meet performance, integrity, and reliability expectations for 3DICs. Beyond ‘golden solver’ requirements for power, thermal and electromagnetic analysis, it’s necessary to have a productive methodology within a diversified ecosystem of multiple components. Various teams designed these components using different implementation tools and validated them by numerous sign-off experts.
This introduction explains how we address this need with a Multiphysics, comprehensive, and fully-opened solution, taking interposers as an analysis use case.
3D-IC chip, package and PCB designers