Skip to Main Content

 

WEBINAR

Ensuring Accurate Material Properties for Simulation with Digital Image Correlation (DIC)

The coefficient of thermal expansion (CTE) is one the most important factors affecting solder fatigue. Thus, knowing the accurate CTE for your materials is essential when designing electronics and selecting parts. With increasingly complex materials and architectures being used in complicated simulations, digital image correlation (DIC) can help you to ensure the accuracy of those simulations. DIC is especially critical for capturing the behavior of electronic components and circuit boards when simulating their response to thermal, thermomechanical and mechanical loads.

In this webinar you’ll learn how DIC material testing can be used to accurately measure the CTE of components and boards, as well as how the technique can be used to identify the glass transition temperatures of polymeric materials like pottings, underfills and coatings, which are often within the operating temperature range of electronics.

SHARE THIS WEBINAR

查看 Ansys 的服務與產品

立即聯絡我們

* = 必填欄位

感謝您聯絡我們!

我們將在此解答您的問題,並期待與您交流互動。Ansys 的銷售團隊成員會立即與您聯絡。

Footer Image