Electrothermal Signoff for 2.5D and 3D-IC Systems [SemiWiki]
System-in-package (SiP) designs for high-performance computing (HPC), high-speed networking, and AI applications are extremely complex. To achieve maximum performance without exceeding tight thermal and power constraints, these chips must be designed within the context of the package and the overall system. Ansys 2.5D/3D-IC multiphysics simulations for prototyping and signoff offer a complete methodology for analyzing power, signal, thermal and mechanical integrity across the entire implementation, ranging from chip to package to board level. This concurrent analysis approach improves engineering efficiency, attains higher simulation accuracy and accelerates a project’s time to results.
This webinar showcases tools, such as Ansys RedHawk-SC Electrothermal, and techniques for modeling multi-die systems, like HBM and PCIE interfaces, with silicon interposers, through-silicon vias (TSVs) and microbumps. It will also show how to perform signoff analysis on multi-die systems for power integrity, signal integrity, thermal integrity and mechanical stress/warpage.
Speakers: Marc Swinnen, director of product marketing, Ansys and Sooyong Kim, director product specialist, Ansys